News
BOSTON – Global first-quarter service provider switching and routing equipment sales grew to $3.1 billion overall, a 25% increase compared to a year ago, research firm Ovum RHK said.
SAN JOSE, CA – The worldwide IC packaging market reached $30.5 billion in 2007, reports Electronic Trend Publications. Some 151 billion ICs were produced during the year.
Modest growth should continue in 2008 and 2009, before accelerating in 2010, the firm says.
ETP found contract-packaging companies assembled nearly 49 billion ICs last year, or one-third of all components – for a value of $12.1 billion. The firm estimates the worldwide semiconductor output will grow to 261 billion ICs in 2012, a value of $47 billion.
Modest growth should continue in 2008 and 2009, before accelerating in 2010, the firm says.
ETP found contract-packaging companies assembled nearly 49 billion ICs last year, or one-third of all components – for a value of $12.1 billion. The firm estimates the worldwide semiconductor output will grow to 261 billion ICs in 2012, a value of $47 billion.
FRAMINGHAM, MA – The stagnant economy will drive overall IT spending growth down to 4% in the US this year, compared to last year's growth of 6%, IDC says.
MANASSAS, VA – Zestron America named Neil Murphy Northeast sales manager, responsible for products and services.
Murphy has a bachelor’s from the University of Massachusetts, and 28 years of sales and technical experience in the electronics and semiconductor manufacturing industry.
Murphy has a bachelor’s from the University of Massachusetts, and 28 years of sales and technical experience in the electronics and semiconductor manufacturing industry.
FRAMINGHAM, MA – The worldwide EMS industry grew 17% in 2007 to $268.1 billion, according to research firm IDC. ODMs grew 23%, yet remain a smaller share of the outsourced market, as the EMS sector accounted for more than 60%.
TUCSON, AZ – The ESD Association’s 30th annual symposium will take place in Tucson, AZ, Sept. 7 to 12.
The EOS/ESD Symposium consists of tutorials, technical sessions, workshops, and exhibits. Topics of 29 tutorials will include ESD basics for program manager; ESD on-chip protection in advanced and RF technologies; air ionization; EOS/ESD failure models and mechanisms; in-plant ESD survey and evaluation measurements, and CDM design and characterization.
A two-day S20.20 seminar on developing and implementing an ESD control program also will be offered.
Technical sessions will include more than 40 papers that will address device testing, ESD-RF design considerations, factory/materials, system level testing, and other ESD-related topics.
Ten interactive workshops will include ESD control and design for extremely sensitive (Class0) devices; ESD protection targets; automated equipment and grounding issues, and protecting high frequency circuits.
For more information, visit www.esda.org/symposia.html.
