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LOS ANGELES – Speedline Technologies will present seven papers at the Apex technical conference later this month.

According to Vice President of Marketing and Business Development Keith Favre, “With our substantial internal technical resources and our valued relationships with leading academic institutions and business colleagues, we are pleased to continue a long-standing commitment to develop and publish best practices for SMT manufacturing processes.”

Presentations include:

Establishing Stencil Design Parameters for 01005 and 0201 Passives and 0.4mm CSPs by Joe Belmonte, Dr. Rita Mohanty, Vatsal Shah, Speedline Technologies; Tim Jensen, Dr. Ron Lasky, Indium Corporation.

Flux Application for Lead-Free Wavesoldering by Kenneth Kirby, Speedline Technologies.

Process Development and Characterization of Stencil Printing Process for Small Stencil Apertures by Srinivasa R. Aravamudhan, Intel Corporation; Dr. Daryl Santos, SUNY Binghamton, NY; Dr. Rita Mohanty, Speedline Technologies.

Hybrid Drying Technology for Inline Aqueous Cleaning of Lead-free Assemblies by Dirk Ellis, Speedline Technologies.

Reflow Process Control Monitoring and Datalogging by Dr. Rita Mohanty, Marc Apell, Tad Formella, Richard Burke, Speedline Technologies.

Tin Corrosion and Lead-free Wave Soldering, by Dr. Matthew J. O’Keefe, Dr. Martin Perez, University of Missouri; Jim Morris, Speedline Technologies.

Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste by Joe Belmonte, Vatsal Shah, Dr. Rita Mohanty, Speedline Technologies; Tim Jensen, Dr. Ron Lasky, Indium Corporation.

The conference takes place the week of Feb. 19, in Los Angeles.

PHOENIX -- Electronics manufacturing services firm Suntron Corp. will sell its Garner, IA, plant to Nortech Systems for an undisclosed sum. Nortech will acquire the assets, intellectual property and customers associated with the operation. The deal includes the plant's management and about 100 employees.

RICHARDSON, TX -- TXP Corp., a small EMS provider, will restate its financials for the June and September 2006 quarters, the company said Friday. The company anticipates reporting a higher net loss for the nine months ended Sept. 30 by $697,000.

TXP said it intends to file the new statements during the current quarter.

LOS ALTOS, CA – Chinese vehicle production is estimated to have risen 12.1% during 2006, according to analyst Henderson Ventures' latest forecast summary.

The research group says world unit vehicle sales rose 4.4% last year, after a 5.2% gain in 2005. Unit production of cars and light trucks is expected to be up 2.9% in 2007, in part as a result of higher-end vehicles with electronic modules.

ATLANTA -- The first revision of IPC-7525, “Stencil Design Guidelines” was circulated for vote in February, and could be published shortly. Among the proposed changes: Refined aperture configurations and area ratios, and new guidelines for printing adhesives.

For its latest revision, the task group behind IPC-SM-840D, “Qualification and Performance of Permanent Solder Mask,” focused on terminology, consolidation, the Pb-free dilemma and test methods.

In a recent interview with Circuits Assembly, longtime task group chair Dave Vaughan, marketing manager, Taiyo America, noted that revision D began simultaneously with the Solder Mask Handbook. In fact, it began with the term “solder mask” itself.