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BOSTON -- Softer market conditions and high lift capacity eliminated most freight backlogs at major transit hubs around the world.

Fuel surcharges are drifting downward compared to last year. Carriers serving markets in China, the Indian subcontinent and Southeast Asia reported lower fuel costs, says Trans Global Logistics, a global logistics provider.

The firm says most Asia sites anticipate demand for air lift to build this month as factories begin to increase production prior to the end of the March quarter.
NEENAH, WI -- Plexus is expanding its its European design center in Livingston, Scotland, and will add 19 workers to the 12 already employed.
The EMS provider received a £159,000 grant, which will help fund the positions.


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JOHOR, MALAYSIA -- Demand for electronics products will boost Malaysia's manufacturing sectors by some 6.6% this year.

That's down a fraction from 2006 (7%), due to some first-half softness, but growth is expected to pick up in the second half.

The forecasts were included in Bank Negara Malaysia's 2006 Annual Report, released this week.

Several of the world's largest EMS provider have large factories in Malaysia.


CONCORD, CA – Test maker Digitaltest announced 2006 sales grew in the double-digits, as production output rose 10%. The privately held company did not specify actual sales. In the US, Digitaltest had its best year, according to Mark Harding, US general manager. The company said its Grünwettersbach, Germany, facility is operating at full capacity.

ST. PETERSBURG, FLJabil Circuit said second-quarter revenue was $2.9 billion, up 27% year-over-year, beating analysts’ forecast of $2.83 billion. However, the company said previously announced restructuring costs would be at the high end of the estimated range of $200 million to $250 million. The top tier EMS firm forecast third-quarter revenue of $2.9 billion to $3 billion.
ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies multiple contracts totaling $164 million to produce card frame assemblies, including organic semiconductor packaging, module assemblies, printed circuit boards and assemblies, and engineering services. The company did not specify what product the assemblies would be used for. EI recommended its HyperBGA organic substrate as an alternative to ceramic semiconductor packages, leading to the module assembly business and the initial $6.5 million award. Subsequent development and collaboration lead to additional technical scope for follow-on contracts, including PCB fabrication, complex board assembly and higher level integration into card frame subsystems. Contracts totaling $37.5 million product certification, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120 million contract was awarded for the first production order of fully integrated card frame assemblies, to be delivered by year-end. 

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