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ESPOO, FINLANDPCB maker Aspocomp Group will buy the minority stake in its ACP Electronics Ltd. joint venture from Taiwanese partner Chin-Poon Holdings, the company said today.

Aspocomp will spend 37.8 million euros to purchase the 49% minority interest in the Suzhou, China-based company. The deal is expected to be finalized in March.

Aspocomp Group Oyj owns 51% of ACP Electronics, and the JV’s net sales and results have been consolidated into Aspocomp's figures since 2001.

Aspocomp expects the acquisition will be accretive to the company’s result. Last year, Aspocomp reported net sales of 149 million euros. It was the 57th largest PCB fabricator in 2005, according to Dr. Hayao Nakahara of NT Information.

IRVING, TX – Top tier EMS firm Elcoteq has won a multi-year contract to build base stations and other products for Redline Communications. Other terms were not disclosed.
 
Under the deal, Elcoteq will be the primary EMS provider of manufacturing and NPI services for Redline’s RedMAX family of base stations and devices and its RedCONNEX backhaul products.
 
Elcoteq will provide low- to medium-volume production, full system integration, warranty repair and order fulfillment. NPI and manufacturing services will be handled through Elcoteq’s facilities in Dallas and Juárez, Mexico.

SIEVI, FINLAND -- Scanfil PLC, the second largest EMS group in the Nordic region, today announced manufacturing operations at its Oulu plant will end this summer while those at its Äänekoski plant will be transferred to other units by end of September. A total of 95 workers will be laid off.

Scanfil's EMS operations had 2006 sales of about 240 million euros.
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BALVE, GERMANY – Solder material suppliers Balver Zinn and Cobar Group have signed an agreement to merge, a deal that would result in annual company sales of over $50 million. The deal is expected to close during the second quarter. No financial terms were disclosed.
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ST. LOUIS -- LaBarge Inc. named William Bitner vice president of operations, responsible for the EMS company's defense and government-oriented manufacturing operations. He succeeds Vernon Anderson, who is retiring Read more ...
ROME, NY – The Electrostatic Discharge Association will hold a two-day device design seminar at its Rome headquarters this spring. The April 30-May 1 seminar includes ESD in industrial semiconductors; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements and their impact on ESD; CDM ESD protection; and design examples and case studies.
 
Device design and program manager tutorials will take place May 22 - 24 at the BU Corporate Education Center in Tyngsboro, MA: On-Chip ESD Protection in RF Technologies (May 22); Troubleshooting On-Chip ESD Failures (May 22); ESD Basics for the Program Manager (May 23); Packaging Principles for the Program Manager (May 24), and System Level ESD/EMI: Testing to IEC and Other Standards (May 24).
 
Three program manager tutorials will take place May 9 and 10 at the Holiday Inn, Bloomington, MN: How-To’s of In-Plant ESD Auditing and Evaluation Measurement (May 9), Cleanroom Considerations for the Program Manager (May 10), and Air Ionization: Issues and Answers (May 10).
 
For more information and to register, visit www.esda.org/education.html.
 
 

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