News
BERKSHIRE, UK – A just-released NPL report describes developments using a surface insulation resistance test method to assess conformal coating protection performance on electronics assemblies.
In the report, authors Dr. Chris Hunt and L. Zou of the NPL maintain SIR is sensitive in detecting circuit reliability underneath coatings.
In the study, a test vehicle featuring a range of components was used to identify coating protection problems. The procedure on how to choose and apply contaminants to test coupons to simulate the contaminants effect from harsh environments on underlying circuit reliability is detailed, as well as the test parameter settings for SIR test and SO2 exposure testing. The method provides a measurement tool to discriminate between coatings.
The use of this method to investigate the protection performance of seven different types of coatings (two water-based acrylics, solvent-based acrylic, fluoroacrylate, silicone, polyurethane, and epoxy) against solvent-based flux, surfactant and SO2 gas, is included in the appendix.
For more information contact Hunt at chris.hunt@npl.co.uk.
In the report, authors Dr. Chris Hunt and L. Zou of the NPL maintain SIR is sensitive in detecting circuit reliability underneath coatings.
In the study, a test vehicle featuring a range of components was used to identify coating protection problems. The procedure on how to choose and apply contaminants to test coupons to simulate the contaminants effect from harsh environments on underlying circuit reliability is detailed, as well as the test parameter settings for SIR test and SO2 exposure testing. The method provides a measurement tool to discriminate between coatings.
The use of this method to investigate the protection performance of seven different types of coatings (two water-based acrylics, solvent-based acrylic, fluoroacrylate, silicone, polyurethane, and epoxy) against solvent-based flux, surfactant and SO2 gas, is included in the appendix.
For more information contact Hunt at chris.hunt@npl.co.uk.
EL SEGUNDO, CA — iSuppli will host a Webinar on China’s DTVs, STBs & Handset Design Dynamics on May 11 at 8:30 am Pacific.
Byron Wu, director & principal analyst, China Research, will tackle such issues as China’s local handset design market; the forecast for local design handset shipments by different suppliers and technology; average selling price trends and bill-of-materials costs of handsets; the status of the 20 semiconductor suppliers in China’s DTV market, and design influence trends in China’s DTV industry.
Of the 70 million color television shipments in China in 2006, ODMs and EMS providers produced 20 million. With several dozen DTV design houses emerging in China, they are beginning to provide both semi-knock down and complete knock-down services domestically in cooperation with semiconductor suppliers, says iSuppli.
Byron Wu, director & principal analyst, China Research, will tackle such issues as China’s local handset design market; the forecast for local design handset shipments by different suppliers and technology; average selling price trends and bill-of-materials costs of handsets; the status of the 20 semiconductor suppliers in China’s DTV market, and design influence trends in China’s DTV industry.
Of the 70 million color television shipments in China in 2006, ODMs and EMS providers produced 20 million. With several dozen DTV design houses emerging in China, they are beginning to provide both semi-knock down and complete knock-down services domestically in cooperation with semiconductor suppliers, says iSuppli.
China is trying to become a major force in handset design as well, adds the firm. Local design of handsets reached 129 million units in 2006, with that number expected to grow to 170 million in 2007 as a result of increasing shipments from Chinese handset OEMs, independent design houses and ODMs, iSuppli predicts.
What are the Top-50 Chinese handset manufacturers doing to take advantage of strong demand? How can China’s handset industry improve its design capabilities? What is being done to compete against the gray-market handset suppliers and to win more sales overseas? How are DTV design houses distributing DTV chipsets in China? What role will design houses play in supplying TV chips to Chinese manufacturers?
For more information about the Webinar, please visit:
What are the Top-50 Chinese handset manufacturers doing to take advantage of strong demand? How can China’s handset industry improve its design capabilities? What is being done to compete against the gray-market handset suppliers and to win more sales overseas? How are DTV design houses distributing DTV chipsets in China? What role will design houses play in supplying TV chips to Chinese manufacturers?
For more information about the Webinar, please visit:
PROVIDENCE, RI – Cookson Electronics Assembly Materials will host an Automotive Electronics Technology Day on May 23 at the ZVE Training Center in Oberpfaffenhofen, Germany.
This technical forum will include keynotes by Cookson Electronics, Seho, Siemens Corporate Technology and Lackwerke Peters, along with two Q & As.
Engineers and executives who select and specify parts and materials for automotive electronics systems assemblies, and specialty finishes for automotive parts, will debate the latest technological developments.
To register, please email cgudden@cooksonelectronics.com.
SAN JOSE, CA – With 137 billion ICs produced, the value of the worldwide IC packaging market was $27.3 billion in 2006, reports Electronic Trend Publications in its Worldwide IC Packaging Market, 2007 Edition. Growth will reportedly continue to occur through 2008, with a probable slowdown in 2009, says the researcher.
HERNDON, VA – Industry-led consortium iNEMI today announced a majority of its OEM and EMS members strongly support unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405.
Concerned about changes in metallurgies, iNEMI informs that variations can impact the manufacturing process, including form, fit and function of a device. According to members, they should be documented by the issuance of a part change notice and should be associated with a change in manufacturing part number. In this way, the manufacturing assembly process can be properly controlled prior to actual assembly to ensure reliable attachment of the BGA to the next higher assembly and to help minimize ship holds as a result of unknown parts, iNEMI says.
iNEMI members in support of this proposal include Agilent, Celestica, HP, Intel, Jabil Circuit, Microsoft, Plexus, Sanmina-SCI, Solectron and Tyco Electronics, among others.
In 2004, iNEMI called for the use of unique part numbers for RoHS-compliant components, as defined by JEDEC/IPC standards. The consortium is also calling for continued availability of SnPb BGAs for use in high-reliability products, which are currently exempt from the EU RoHS Directive. Manufacturers of these high-reliability products will continue to use SnPb processes until long-life reliability concerns regarding Pb-free are resolved, and Pb-free BGAs are not compatible with these processes, says the consortium.
TOKYO – Japan's TDK Corp. will invest about $416 million on an electronics component factory, according to a Bloomberg report.
A TDK spokesman said the factory in Yurihonjo will increase the company's manufacturing capacity of ceramic capacitors by 40%. The company will begin building the factory in June, and production will start in the second quarter next year.
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