News
SINGAPORE – Flextronics reported fourth quarter net sales of $4.7 billion, a 32% increase year-over-year. Net income for the same quarter was $121 million, an increase of 181% over $43 million in the fourth quarter.
For fiscal 2007, sales were $18.9 billion, a $3.6 billion increase over fiscal 2006 – a record high. Net income improved to $509 million, compared to $141 million in 2006.
In December, the contract manufacturer acquired Roseville-based International DisplayWorks Inc.
LYON, FRANCE – A recent market study from Yole Developpement reveals that the global microelectromechanical systems industry reached almost $6 billion in 2006, and is growing at a CAGR of 14%. The trend toward more MEMS use in consumer applications and higher volumes in the automotive industry are driving the move from 6" to 8" wafers, the company says.
The report states most new companies are fabless or "fab-lite," contracting out to existing MEMS- or IC-manufacturing infrastructures.
Texas Instruments ranked first in the top 10 MEMS producers in sales, followed by Hewlett-Packard, Robert Bosch, Lexmark, Seiko Epson, STMicroelectronics, Canon, Freescale, Analog Devices and Denos, according to the research firm.
TAIPEI – Foxconn Electronics (Hon Hai Precision Industry) reported another stellar first quarter, with net earnings of $15.6 billion, up 48.9% year-over-year.
SAN JOSE, CA – Monthly worldwide semiconductor sales rose 1% sequentially to $20.3 billion in March, 3.2% higher than the $19.7 billion reported in March 2006, SIA reported today.
SAN JOSE – Stanford professor of engineering Roger Howe will keynote the 5th Annual MEMS Packaging symposium, the MicroElectronics Packaging and Test Engineering Council announced. On May 16, Howe will discuss recent developments in the field. Howe, who has decades of experience with MEMS, also chaired the MEMS Technical Committee of IEEE Electron Devices Society from 1998 – 2001. The conference takes place May 16-17 in San Jose. Other presentations include MEMS-based market evolution; emerging trends; packaging technologies, and consumer and industrial applications. Graduate students, professors and university researchers will also present their latest work on MEMS packaging and related topics. To register or learn more about the symposium, contact Bette Cooper, bcooper@meptec.org or visit www.meptec.org.
BANNOCKBURN, IL – IPC is accepting comments on IPC-9592, Performance Parameters for Power Conversion Devices. The document standardizes the performance parameters for power conversion devices, including the computer and telecommunications industries. The specification also sets the requirements for design, qualification and conformance testing, manufacturing quality processes, and regulatory requirements. Comments are due June 2. A copy of the document and the comment form are available at ipc.org/PCSMeeting. The nearly 100-page proposal was developed by the IPC Power Conversion Subcommittee, chaired by Dr. Scott Strand of IBM. The next committee meeting will take place June 26-27 in Schaumburg, IL.
