News
SPOKANE, WA – EMS firm Key Tronic Corp. reported third-quarter revenue of $47.2 million, up 4% year-over-year. For the first nine months of fiscal 2007, total revenue was $152.6 million, up 13% from last year.
Net income for the quarter was $700,000, down 22% from 2006. Year to-date net income was $2.5 million, down 3.8%.
The company expects fourth quarter revenue of $45 million to $49 million, excluding an anticipated $2.7 million gain from the sale of its Las Cruces facility.
Net income for the quarter was $700,000, down 22% from 2006. Year to-date net income was $2.5 million, down 3.8%.
The company expects fourth quarter revenue of $45 million to $49 million, excluding an anticipated $2.7 million gain from the sale of its Las Cruces facility.
ELKHART, IN – CTS Corp. reported fourth-quarter net earnings rose 2.7% to $7.7 million on a 1% hike in revenues to $173.5 million.
Revenues were boosted by a 17% increase in EMS sales to the defense/aerospace, medical and communications markets, the company said. Components and Sensors sales increased 5%, primarily for automotive products. Sales were partially offset by weakness in electronic component demand and lower component sales for handset applications, CTS reported.
Revenues were boosted by a 17% increase in EMS sales to the defense/aerospace, medical and communications markets, the company said. Components and Sensors sales increased 5%, primarily for automotive products. Sales were partially offset by weakness in electronic component demand and lower component sales for handset applications, CTS reported.
RUSHVILLE, IN – Fujitsu Ten Corp. of America plans to move its manufacturing operation from Rushville, IN, to Reynosa, Mexico.
FTCA says approximately 130 local employees will lose jobs by 2008 because of the move. Roughly 60 workers will continue to work in Rushville in distribution and customer service. The factory makes automotive electronics.
FTCA says approximately 130 local employees will lose jobs by 2008 because of the move. Roughly 60 workers will continue to work in Rushville in distribution and customer service. The factory makes automotive electronics.
MANILA – Texas Instruments will invest $1 billion over 10 years on an assembly/test site in the Philippines that aims to be the most environmentally efficient in the world. At 77,000 sq. meters, the site within the Clark Freeport Zone is expected to eventually employ about 3,000 workers and will double the capacity that TI has in the Philippines.
The site will incorporate many of the environmental and energy design features first used in the U.S. at TI’s newest semiconductor facility. Reducing water, energy and waste will be given priority consideration, and it will be the first ground-up facility to be Leadership in Energy and Environmental Design (LEED) registered in the Philippines.
Construction is expected to start in the second half of 2007, with initial production in the second half of 2008.
TI first entered the Philippines in 1979 in Baguio City. It conducts final assembly and testing of semiconductors for customers in the computer, aerospace, telecommunications, and automotive industries in the United States, Asia, and Europe.
The site will incorporate many of the environmental and energy design features first used in the U.S. at TI’s newest semiconductor facility. Reducing water, energy and waste will be given priority consideration, and it will be the first ground-up facility to be Leadership in Energy and Environmental Design (LEED) registered in the Philippines.
Construction is expected to start in the second half of 2007, with initial production in the second half of 2008.
TI first entered the Philippines in 1979 in Baguio City. It conducts final assembly and testing of semiconductors for customers in the computer, aerospace, telecommunications, and automotive industries in the United States, Asia, and Europe.
ARMONK, NY – IBM this week claimed to be first to apply a self-assembling nanotechnology to conventional chip manufacturing. The company expects to have the technology ready for wide-scale use by 2009.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
ATLANTA — Siemens Energy and Automation, Inc. this week appointed Dennis Sadlowski president and CEO. Sadlowski succeeds Aubert Martin, retiring after 40 years with Siemens.
Sadlowski started at SE&A in 2000 as a VP and GM in Atlanta. From 2003 to 2006, Sadlowski led the Siemens Automation and Drives Sensors business in Germany. In 2006, he returned to Atlanta as COO, while concurrently managing the Power Distribution & Controls Division.
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