ATLANTA – UP Media Group, parent company of Circuits Assembly, announced today that a 60-minute Webinar, Korea RoHS/ELV – What You Need to Know, will be held Aug. 14 at 12 PM EDT.
The Webinar will be presented by Michael Kirschner, president of Design Chain Associates LLC, and Junsik Yoon, an associate with Korean environmental firm Eco-Frontier.
The Webinar will help electronics and automotive companies understand and comply with Korea’s RoHS-, WEEE-, and ELV-like regulation when it goes in to force on Jan. 1.
Korea's Act for Resource Recycling of Electrical/Electric Products and Automobiles has elements of several EU directives such as RoHS, WEEE, ELV, and EuP, and has a short timeline and details that will not be officially published until fall.
Yoon’s presentation will describe the law, similarities and differences between it and the relevant European directives, and the implementation requirements for the Jan. 1 deadline. Kirschner will describe the steps to compliance OEMs must take to ensure compliance.
Registration for the event, which will include a Q&A session, costs $169 and is available online at www.pcbshows.com/webinars.
FREMONT, CA – Dage Precision Industries this week released a self-authored reference booklet, High-Speed Bondtesting – Understanding the Technology.
The teaching aid and reference guide provides information about reliability testing of BGA and CSP solder ball interconnections. The contents also include information on the theory and practice of high-speed bondtesting, impact testing applications, evaluation of pad finishes and solder ball alloys, and Pb-free solder ball joint evaluation and brittle fracture joint failure analysis.
The book is 30 pages and illustrated with images and diagrams, and can be obtained by contacting sales@dage-group.com.
EL SEGUNDO, CA – The market for Internet TV service will reach $5.8 billion in 2011, up 13.7 times from $422.7 million in 2006, iSuppli Corp. predicts.
The Web is quickly growing into the world’s largest on-demand, interactive video library. The Internet also is evolving into the most ubiquitous video distribution platform ever known, says the firm.
iSuppli notes that as more consumer electronic devices like TVs, DVD players, game consoles, iPods and portable gadgets become Web-connected, Internet TV will leap from computer screens into the consumer’s primary media environment: the living room TV.
With Internet TV, content owners face the trade-off of “reach” versus “control,” while video network operators face a new way to reach consumers, as well as a new competitive threat that could put pressure on their long-term position in the market.
Meanwhile, a variety of Internet portal companies, content delivery networks, software platform companies and other technology providers embrace the revenue opportunity, says the researcher.
iSuppli also found that while news was the largest revenue category for advertising supporting professionally generated Internet TV in 2006, it will be third by 2009, behind sports and entertainment. Also, bandwidth required for Internet TV will grow by more than 44 times from 2006 to 2011 to almost 7 million Tebibytes, the company says.
Internet TV will be dominated by North America and Western Europe, says iSuppli. Regions such as Latin America and Eastern Europe will not have significant Internet TV penetration through 2011.
SHENZHEN — Nepcon EMT South China will take place Aug. 28-31 at the Shenzhen Convention and Exhibition Center.
This year's show will be held in conjunction with Automotive Electronics China and Assembly Expo China, bringing together 450 exhibitors from 22 countries, according to the show organizers.
The Nepcon event is expected to draw up to 18,000 attendees, says Reed Exhibitions.The show includes aconcurrent technical conference.
Also running that week: the SMTA China South Conference.
SAN JOSE, CA – The global semiconductor materials market is expected to grow more than 10% in 2007, and is forecasted to grow another 10% next year, SEMI reports.
Growth is being driven by record numbers of semiconductor devices being manufactured and materials consumed in fabricating and packaging those devices, says the association.
Growth is expected both in wafer fab materials and packaging. Current estimates predict that fab materials will grow about 9% to $24 billion, and packaging materials will rise more than 13% to $16.6 billion this year, according to SEMI.
On a regional basis, both Japan and Taiwan are anticipated to remain the two largest material-consuming regions, followed by the South Korean and Southeast Asian regions.
The materials market in China grew 36% last year as the result of capacity coming online from renewed fab and assembly facility investments; it is expected that wafer fab materials will represent a larger portion of materials consumed in this region in the near future, says the association.
“Semiconductor unit growth, the 300 mm ramp, and the transition to flip chip packages are driving the revenue growth in the semiconductor materials market,” said Dan Tracy, senior director of Industry Research and Statistics of SEMI. "However, higher raw material costs represent a major challenge for both material suppliers and their customers.”