News
FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
MINNEAPOLIS, MN – The 2007 Charles Hutchins Grant Award, cosponsored by Circuits Assembly and SMTA, has been given to Gayatri Cuddalorepatta for her project, Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach.
SCOTTSDALE, AZ – IC Insights believes Asia-Pacific will continue to gain marketshare and represent almost one-third (32%) of worldwide IC sales in 2011.
Asia-Pacific companies have grown from holding only 2% of the IC market in 1985 to 26% in 2006, says IC Insights. The Asia-Pacific supplier segment is primarily composed of Taiwanese, South Korean, and Chinese companies.
After reaching a high of 51% in 1988, Japanese IC suppliers have displayed a steady decline in marketshare; in 2006, the Japan-headquartered companies' share dropped to only 17% of the IC market. IC Insights believes Japanese companies will continue to lose IC marketshare during the next five years, to a 14% share in 2011.
In 2006, IC companies headquartered in the Americas region held almost half of the worldwide IC sales marketshare, says the firm.
Since 1982, European companies have always held 8-10% of the worldwide IC market. IC Insights believes European companies will stay in this range through 2011.
MILPITAS, CA – Lead-Free Soldering, a hardback book from Solectron Corp., offers a collection of practical techniques for lead-free soldering design and manufacture.
The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.
Written by recognized experts in both academia and industry, Lead-Free Soldering is a guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework, solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
To purchase the text for $129, email orders-ny@springer.com.
EL SEGUNDO, CA – Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8% from 2005, according to iSuppli Corp.
WASHINGTON, DC – U.S. high-tech goods exports increased by 10% to $220 billion, while imports rose by 9% to $322 billion between 2005 and 2006, according to AeA's first edition of “Trade in the Cyberstates 2007.”
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