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GREENVILLE, SC, Jan. 11 -- Kemet Corp. said today that December revenue was down 10% sequentially due to paring of inventories at its distributors. The parts maker said March revenue should improve compared to December.

Speaking at the Needham Growth Conference, chief executive Dr. Jeffrey Graves said, "During our last earnings conference call, we reported that Kemet distributors had built inventory of parts in the June quarter in anticipation of strong growth in their sales in the second half. When their sales growth was more moderate than they expected, in the September quarter they reduced inventory levels, resulting in reduced Kemet revenue in the September quarter. This inventory correction continued into the December quarter."

LOUISVILLE, Jan. 11 -- Sypris Solutions Inc. today bottomed its outlook for the fourth quarter, citing cost overruns and higher training costs.

The company expects to report a fourth-quarter loss of $0.07 to $0.10 per diluted share, compared to prior guidance for earnings of $0.17 to $0.20.

Expected revenue is $121 million to $123 million, which is consistent with prior guidance of $120 to $124 million.

"In many respects, we paid the price for this year's rapid growth during the fourth quarter," said Jeffrey T. Gill, president and chief executive, in a statement. "We experienced inefficiencies associated with rapidly changing demand and continued steel shortages, cost overruns for the installation of new manufacturing cells, increased costs for training people for new programs and additional charges to reflect the growing nature and complexity of the business, among others."

Gill said that while the company has resolved the "vast majority" of its issues, some further short-term expenses are expedted.

A series of programs coming online during the first half are forecast to increase revenues by $50 million to $60 million annually.

The company left its revenue outlook unchanged, with 2005 sales forecast to be up 20% to $500 million to $520 million. It cut earnings to $0.75 to $0.95 per diluted share, versus prior guidance of $1.00 to $1.10.

Sypris is a contract manufacturer of aerospace and defense electronics.

ANAHEIM, CA, Jan. 11 -- Next year's Measurement Science Conference will take place Feb. 27 to March 3, organizers said today.

The Measurement Science Conference consists of seminars, workshops and tutorials. The conference will be held at the Disneyland Hotel and Conference Center.

Also, the latest in measurement related equipment, systems and software will be exhibited. For details: msc-conf.com.

WILSONVILLE, OR, Jan. 11 -- Mentor Graphics said preliminary fourth-quarter bookings and revenues suggest records in both categories, with revenues expected to exceed First Call consensus estimates of $204 million.

Bookings were up about 40% year-over-year. Backlogs rose 35% from a year ago, the company said.

However, special charges are expected to result in GAAP basis earnings below guidance. Pro-forma earnings are expected to modestly exceed consensus estimates.

Bookings was broad-based across all regions and product lines. North America

was up 15%, Europe 50%, and Japan and the Pacific Rim both up over 100% vs. last year.

Mentor will release fourth quarter and full year results after market close on Jan. 27.

BOSTON, Jan. 7 -- Teradyne Inc. will lay off 320 employees and vacate a plant in California as part of an effort to cut expenses. The company will take an $11 million charge.

In an SEC filing today, Teradyne said it would terminate approximately 320 employees from its Connection Systems and Assembly Test divisions and vacate a facility leased by the company's Assembly Test division in Poway, CA.

The restructuring is expected to be completed during this quarter.

by Mike Buetow
Jan. 14, West Haven, CT - Enthone Inc. will discuss the latest in lead-free final finishes and microvia metalization during a series of presentations at an upcoming trade show.

Enthone will sponsor 30-minute presentations at the booth of its parent company, Cookson Electronics, during IPC Apex/Printed Circuits Expo. The sessions will provide the most recent advancements in. The include:

Presentations will cover advancements in microvia fill applications using patented direct metalization and copper via fill systems, and lead-free silver finish OSPs said to be able of handling multiple reflows.

Presentations will be made on Feb. 22 and 23. Seating is limited; email Barry Lee Cohen at bcohen@cooksonelectronics.com to reserve.