News
SAN JOSE -- Flextronics, the world's largest contract electronics manufacturer, last night reported first-quarter net sales of $3.9 billion, up $17 million over last year.
For the quarter ended June 30, Flextronics' pro-forma net income rose 27% to $99.6 million. GAAP net income slid $15.6 million to $58.7 million year-over-year.
SAN JOSE -- Revenues of EMS provider Sanmina-SCI fell 8% to $2.83 billion and the company was hit with a quarterly loss of $202,000 due to restructuring charges taken in its fiscal third quarter.
Sanmina-SCI recorded a profit of $11.4 million last year. For the June quarter, the pro-forma profit was $24.4 million, down from $34.4 million a year ago.
MYRTLE BEACH, SC -- AVX Corp. reported net sales of $319.8 million for its fiscal first quarter ended June 30, down 7% year-on-year but up 4.5% sequentially. Net income was $10.2 million, down 55% year-on-year.
John Gilbertson, president and chief executive, said, "The sales increases in the last two quarters indicate that end market growth is continuing, and this is a positive sign for AVX and the industry."
Sequentially, profit from operations improved to $10.1 million. Profit from operations was $30.7 million last year.
Cash and short and long-term investments in securities increased $5.4 million to $725.9 million during the quarter.
Redmond, WA -- Datalight and Data I/O Corp. announced a joint technology effort aimed to ease the task of bringing NAND Flash products to market.
As market demand for increased memory in electronic products has surged, designers of new products increasingly use NAND Flash memories in new designs to capture a cost advantage. The challenge is that NAND memories require bad-blocks to be detected and managed while writing to the device. The joint effort hopes to enable NAND flash users to leverage performance capabilities, shortening the development cycle and ensuring accurate handling of bad blocks.
Datalight specializes in system software to help OEMs add value to embedded devices. Data I/O is a provider of manual and automated device programming systems for programmable flash technologies.
BUFFALO, NY – NanoDynamics has opened an online Sample Store (nanodynamics.com/Home/samplestore) to minimize the hassle of evaluating or qualifying its products. Customers can order metal powder samples over the Internet and have them delivered anywhere.
The store will initially offer nanosilver and copper powder lines, with future plans to include nanosized nickel powders, nanoceramic powders and dispersions, carbon nanotubes and nanoclays.
FREMONT, CA -- SensArray Corp.’s new Assembly and Test Business Unit delivers process optimization tools for backend semiconductor manufacturers. The unit currently markets six applications, as well as custom control systems for the wafer bumping process.
Backend assembly and test, including wafer solder bumping and solder reflow, requires increasing thermal monitoring and control. As temperature controls narrow from +/- 10 to +/- 5°C, and soon to +/- 1°C, tighter tolerances are necessary; meanwhile temperatures are going up, demanding even more process control.
The company has created a system bundle from its current tools for measuring real-time, in situ temperature in backend processes. These include:
* Process Probe 1935 thermocouple (TC)-instrumented wafer used to check wafer center-to-edge thermal stresses during loading and ramping,and calibrate temperature set-points in ovens with confidence;
* Process Probe 1630 TC-instrumented wafer designed for reflow oven profiling up to 800°C;
* Process Probe Custom Reflow Probes to determine edge-to-center temperature to adjust heater zone set points, and measure and adjust drift in temperature due to oxide build-up on the heaters and belt;
* PDA-based Thermal TRACK measurement systems, used with Process Probes, for real-time visual representations of the wafer temperature and uniformity measurements;
* Laptop-based Thermal MAP metrology systems to deliver graphic representations of temperature ramp-up, steady state and ramp-down;
* Intelligent Sensor Interface System (ISIS) 5 module is wireless, using Bluetooth technology for portability and ease-of-use.
Currently available in the U.S., Europe and Asia. For more info, visit sensarray.com.
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