SAN FRANCISCO -- The July book-bill for makers of semiconductor gear was 0.93, up from 0.90 in June, despite a drop in orders.
A drop in front-end orders masked gains for backend tools. Orders for backend tools jumped 44% quarter over quarter.
FRANKLIN, MA – SMT manufacturers face many misconceptions about the equipment requirements for lead-free wave soldering as they struggle to answer the question: “Is our wave soldering process ready for the transition to lead-free materials?”
To help, Speedline Technologies is hosting a free, live Web seminar on “Lead-Free Wave Soldering.” The event will be held September 15th, from 11 a.m. to 12 Noon, EST.
Topics will include:
* Wave solder equipment configurations
* Flux chemistries and solder alloys
* Material/Equipment interaction
* Defect reduction
For more info.and to register, visit speedlinetech.com/seminars.
TORONTO – In its second acquisition in as many days, Celestica has bought CoreSim, a provider of design analysis and redesign services. The move will strengthen Celestica’s design services by adding intellectual property in the form of unique engineering tools and processes.
TEMPE, AZ – The manufacturing sector grew for the 26th straight month in July as the slowdown in May is looking more like a blip than a trend. New orders and production both saw higher rates of growth, according to the latest Institute for Supply Management (ism.ws) poll.
Teddington, UK – The National Physical Laboratory is hosting a two-day Master Class on Solder Joint Reliability on Oct. 12-13. Industry expert Werner Engelmaier, known as “Mr. Reliability,” will lead the class.
The class will be split into four half-day sessions: 1) Fundamentals in Solder Joint Reliability, 2) Failure Mode and Root Cause Analysis (Fatigue, Brittle Fracture, ENIG) & Acceleration Models, Reliability Tests and Screening Procedures, 3) Reliability Issues for Lead-Free Soldering, 4) Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias, including Lead-Free Solder Impact.
Engelmaier’s background enables him to address the issues underlying electronic packaging from a system’s point-of-view, dealing with synergistic interdependence of material behaviour, processing aspects, thermal design, functional and environmental requirements.
He established the Product Reliability Main Committee of the IPC and has been Chairman since its inception. Author of over 150 technical publications, he holds two patents.
For more info: www.npl.co.uk/ei/news/
Carlsbad, CA– Asymtek and Emerson & Cuming will host a seminar in Taoyuan, Taiwan, to address new solutions for hand-held and computing manufacturing. The free workshop, help August 19, will discuss how technology evolution impacts material selection and processing.
Industry speakers will discuss lead-free regulations and other factors affecting new processing technology, like thermal management solutions and jet dispensing rather than needle dispensing for optimum throughput requirements.
The free seminar will be held from 9:00 a.m. to 4:30 p.m. at the Sunrise Country Club, with a buffet lunch. For information, contact Patrick Lee, Asymtek regional sales manager at 886-2-2902-1860, plee@asymtek.com; or Andy Yang, Emerson & Cuming’s Greater China sales manager at 886-9-3219-2400, andy.yang@nstarch.com.