News
HSINCHU, TAIWAN -- Powertech Technology Inc. has licensed
IBM's MPS-C2 (Metal Post Solder-Chip Connection) technology, the company said today. No financial terms were disclosed.
MPS-C2 is a ultra fine pitch flip-chip package technology for chips with bond pad pitches of less than 80 microns.
It is useful in such applications as cell phones and other mobile applications where conventional wire-bond PoP, PiP or SiP packages might not work.
MPS-C2 is used to make bumps on pads with copper posts and SnAg solder. The bumps are formed on aluminum pads through a wafer plating process without redistribution. The bumps can then be connected to an organic substrate’s copper pads using conventional SMT reflow.
PTI is now the leading memory ODM package and testing house in the world.
MPS-C2 is a ultra fine pitch flip-chip package technology for chips with bond pad pitches of less than 80 microns.
It is useful in such applications as cell phones and other mobile applications where conventional wire-bond PoP, PiP or SiP packages might not work.
MPS-C2 is used to make bumps on pads with copper posts and SnAg solder. The bumps are formed on aluminum pads through a wafer plating process without redistribution. The bumps can then be connected to an organic substrate’s copper pads using conventional SMT reflow.
PTI is now the leading memory ODM package and testing house in the world.
SAN JOSE – Flextronics’ decision to jump in the competitive
notebook PC market is paying off. Today, the EMS company announced a deal with HP
to design and manufacture a high-volume consumer notebook computer. No financial
or other contract details were announced.
HONG KONG – Byd Electronic Co., a provider of mobile handset components and electronics assembly services, reported 2007 revenues of 5.8 billion RMB ($823 million), up 89% year-over-year.
MINNEAPOLIS -- CyberOptics promoted Steven
DiMarco to vice president and general manager, Inspection Systems Business, responsible
for new systems product development and manufacturing center in Singapore as well as global sales and marketing and
service. He has been with CyberOptics since 2005, most recently as vice president
of sales and marketing.
The business unit produces AOI and solder paste inspection systems.
PHILADELPHIA – The American Competitiveness Institute will sponsor a free electronics adhesives workshop on July 11, in Philadelphia.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
NORWALK, OH – EPIC Technologies named Bhawnesh Mathur CEO, effective June 23.
Mathur has nearly 30 years’ experience in electronics with such companies as IBM, Arrow Electronics, and Sanmina-SCI.
EPIC’s former CEO, John Sammut, will guide Mathur during the transition and will remain on the board of directors.
Randy Haight, who had acted as interim CEO, will also resume his role on the board.
EPIC is a specialty electronics manufacturer in the high-mix, low-to-medium volume segment of the industry, providing turnkey services from board layout, test development, prototype testing, PCB assembly, and box build to customers in the medical, automotive, telecommunications, and industrial equipment markets.
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