News
HERNDON, VA – A host of major OEM and EMS companies, under the auspices of iNEMI, has outlined a set of recommendations for managing Pb-free alloy alternatives.
The consortium members recommend the following to help manage the use of multiple solder alloys:
INEMI’s recommendations are available at
http://thor.inemi.org/webdownload/projects/ba/Pb-Free_Alloys/Alloy_recs.pdf.
The consortium members recommend the following to help manage the use of multiple solder alloys:
- Drive convergence of Pb-free alloys.
- Develop an industry-standard assessment methodology.
- Establish performance guidelines.
- Update standards.
- Identify and differentiate alloys.
INEMI’s recommendations are available at
http://thor.inemi.org/webdownload/projects/ba/Pb-Free_Alloys/Alloy_recs.pdf.
NEWARK, NY – EMS firm IEC Electronics Corp. received a $3.7 million order from one of its military and defense customers. Shipments will run from the September quarter through April 2009.
In a statement, chairman W. Barry Gilbert said, “We have a good relationship with this customer. IEC is the exclusive supplier of these products, thus enabling the customer to avoid the uncertainty that can be associated with a new supplier and in turn, allowing us to leverage the experience we have gained from previously building these complex electronics assemblies.”
IEC stressed the latest order is unrelated to a $4.7 million award announced in April, which was for a different program.
BRIDGEWATER, MA – Chase Corp. today reported net income of $3.2 million for its May quarter, up 12% over last year. Revenues fell 2% to $33.9 million from the prior year period.
LAS VEGAS – IPC is requesting abstracts for Apex, which will take place March 31-April 2 in Las Vegas.
Expert presentations are being sought on all relevant design, PCB fabrication and manufacturing topics. Submissions in the areas of new materials and environmental concerns are encouraged. The committee will choose abstracts that describe significant results from experiments, emphasize new techniques or discuss trends and test results.
The deadline for abstracts is July 18.
For more information, visit www.GoIPCShows.org/CFP.
To ask questions about conference participation, contact GregMunie@ipc.org or ToyaRichardson@ipc.org.
For information on teaching a course, contact MichelleMichelotti@ipc.org.
Expert presentations are being sought on all relevant design, PCB fabrication and manufacturing topics. Submissions in the areas of new materials and environmental concerns are encouraged. The committee will choose abstracts that describe significant results from experiments, emphasize new techniques or discuss trends and test results.
The deadline for abstracts is July 18.
For more information, visit www.GoIPCShows.org/CFP.
To ask questions about conference participation, contact GregMunie@ipc.org or ToyaRichardson@ipc.org.
For information on teaching a course, contact MichelleMichelotti@ipc.org.
SHENZHEN – The SMTA China Chapter, in conjunction with the Nepcon South China trade show producers, will sponsor the conference program Aug. 24 – 30, in Shenzhen.
The event will address electronics manufacturing, advanced packaging and Pb-free reliability. Topics will range from 01005 assembly and state-of-the-art inspection and failure analysis to market trends and cost reduction initiatives.
The premiere Nepcon Best Engineer award also will be announced during the event. Engineers can nominate themselves, or companies can recommend candidates through Reed Exhibitions China.
For more information about the SMTA conference and Best Engineer award, visit www.nepconchina.com.
The event will address electronics manufacturing, advanced packaging and Pb-free reliability. Topics will range from 01005 assembly and state-of-the-art inspection and failure analysis to market trends and cost reduction initiatives.
The premiere Nepcon Best Engineer award also will be announced during the event. Engineers can nominate themselves, or companies can recommend candidates through Reed Exhibitions China.
For more information about the SMTA conference and Best Engineer award, visit www.nepconchina.com.
TIJUANA – Catalyst Manufacturing Services has opened a contract manufacturing operation in Tijuana and will begin shipping production volumes later this month.
The renovated 60,000 sq. ft. facility will operate as a full-service turnkey operation working with market segments including medical, aerospace, and industrial.
The contract manufacturing company also has locations in Endicott, NY, and Raleigh, NC.
Catalyst offers product design assistance, documentation development, PCB assembly and test, box build, order fulfillment/logistics, and depot repair services.
The renovated 60,000 sq. ft. facility will operate as a full-service turnkey operation working with market segments including medical, aerospace, and industrial.
The contract manufacturing company also has locations in Endicott, NY, and Raleigh, NC.
Catalyst offers product design assistance, documentation development, PCB assembly and test, box build, order fulfillment/logistics, and depot repair services.
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment