News
BERWYN, PA – Tyco Electronics Ltd. is eliminating about 100 North American jobs, about half from two Pennsylvania facilities.
The firm cites diminished demand from the automotive and consumer appliance industries.
Workers from facilities in North Carolina, Michigan, Mexico and Canada also will be affected, said Tyco spokesman Mike Ratcliff, according to published reports.
The company plans to move some manufacturing from Harrisburg, PA to nearby Waynesboro, as well as Mount Sidney, VA.
The firm employs 92,000 globally and makes electrical components and telecommunications equipment.
LONDON — The Cookson Group's first-half profits rose 30% to $225 million on a 26% jump in revenues to $2.1 billion.
The electronics group reported profits of $60 million, up 2%, year-over-year on an 11% hike in sales to $640 million. However, the higher revenue was driven by extreme price inflation for tin and silver used in solder. Excluding the inflation impact and sales of precious metals related products in the chemistry product line, underlying revenue fell 1% from last year.
All figures are based on constant exchange rates.
Cookson attributed the drop in revenue to a slowdown in electronics equipment production, particularly in the US, and a decision to focus on higher margin, more value-added product lines.
The company benefited from a new factory in Monterrey, Mexico, and demand for its scrap solder recycling operation in the US. A second recycling plant, in Guangxi Province, China, is expected to come online later this year. Cookson is also moving its European solder paste production from Ashford, England, to Hungary; the transfer should be complete by early next year and will save the company about $2 million annually.
NUREMBERG and ARLINGTON, VA – Consumer electronics revenues in China are forecast to reach $100 billion by 2009, surpassing Western Europe and North America between 2009 and 2010, say market researcher GfK and the Consumer Electronics Association.
SAN JOSE – Tessera Technologies Inc., provider of miniaturization technologies, said Bruce McWilliams, its chairman, president and chief executive officer, has stepped down.
ARLINGTON, VA – The Defense Advanced Research Projects Agency provided Northrop Grumman's Electronic Systems a $1.7 million contract to develop an ultra high capacity hybrid thermal ground plane to fight semiconductor-generated heat employed in electronic systems.
The 18-month contract follows a $1.5 million contract awarded earlier this year to the University of Colorado, Boulder and Lockheed Martin to work on comparable technology.
Together, both contracts eventually could be worth about $10 million, says the agency, provided all phases are completed.
These agreements come on the heels of a recent Navy report predicting shipboard cooling requirements would double every six years for the next 20 years.
DURHAM, NC – EMS provider Sanmina-SCI Corp. has been awarded a manufacturing services agreement for production of Parata System's pharmacy automation solutions: Parata Max and Parata Mini.
Production is set to occur at Sanmina’s Medical Division facilities in the Research Triangle Park area of Durham, NC. Parata is also based in Durham.
No financial terms of the agreement were disclosed.
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment