News
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has named Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, as keynote speaker for its Feb. 19 symposium in San Jose.
In his presentation, The Consumer Electronics Boom - How Semiconductor and Consumer Electronics Companies Can Improve Cost, Time-To-Market and Product Quality, Steger will provide analysis of survey results, with a particular emphasis on time-to-market and cost-reduction initiatives.
Other topics at the symposium, titled Semiconductor Packaging – Impacting the Age of Consumer Electronics, include time-to-market and consumer semiconductor packaging; cost-of-ownership challenges for consumer products; solutions for consumer product miniaturization, and advancing technologies for consumer electronics.
In his presentation, The Consumer Electronics Boom - How Semiconductor and Consumer Electronics Companies Can Improve Cost, Time-To-Market and Product Quality, Steger will provide analysis of survey results, with a particular emphasis on time-to-market and cost-reduction initiatives.
Other topics at the symposium, titled Semiconductor Packaging – Impacting the Age of Consumer Electronics, include time-to-market and consumer semiconductor packaging; cost-of-ownership challenges for consumer products; solutions for consumer product miniaturization, and advancing technologies for consumer electronics.
SAN JOSE -- The 90-day moving average sales of semiconductors worldwide fell 30.4% year-over-year in February, the Semiconductor Industry Association reported today. Sales declined 7.6% sequentially, the trade group said.
SAN JOSE -- SEMI is launching an electronic information exchange forum for EHS regulatory compliance issues.
SAN JOSE -- Flextronics is analyzing the potential effects of Nortel’s
impending bankruptcy on the EMS company’s finances and operations.
The contract assmbler has contracted with Blackstone Group as a financial adviser to study the impact, the company revealed.
The contract assmbler has contracted with Blackstone Group as a financial adviser to study the impact, the company revealed.
BANNOCKBURN, IL — IPC this week released its biennial technology roadmap for printed circuit boards and electronics assembly.
LAS VEGAS – The International Electronics Manufacturing Initiative debuted its latest industry roadmap this week, highlighted by new chapters on photovoltaics, solid state illumination and RFID item-level tags.
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment