Log in
/
Register
HOME
Advertising
Sales Contacts
Media Kit
Editorial
Archive
Editorial Contributions
News
New Products
Features
The Route: Printed Circuit Engineering Association News
Hall of Fame
NPI Award
Service Excellence Award
White Papers/e-Books
PCD&F
Book Reviews
Research
Market Data
SMT Equipment Suppliers
PCB Update
Events
PCB West
Industry Events
PCB2Day Workshop Series
PCB East
Subscribe
Search
Home
News
News
2006 News
Fintech to Rep TPT's Wire Bonders in America
News
News
Fintech to Rep TPT's Wire Bonders in America
Published: 17 November 2006
by Mike Buetow
TEMPE, AZ -- Finetech
will offer
Technical Product Trade's
wire bonders in North America, the company said today. No financial details were disclosed.
Wessling, Germany based TPT makes benchtop manual and semiautomatic wire bonders.
Prev
Next
JULY ISSUE
View the Digital
Edition Here!
Press Releases
ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
Trilogy-NET Adds Second Vapor Phase Reflow System to Expand High-Precision Manufacturing
Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
POPULAR
Editorial Contributions
When Do You Need Nitrogen in Reflow?
Verifying PCBA Cleanliness with Ion Chromatography
Breaking the Six Sigma Wall with Causal AI
The Importance of Test Probing in PCB Manufacturing
Current Issue
News
Products
PCB Chat
Contacts
Login
Don't have an account yet?
Register Now!
×
Sign in to your account
Username *
Password *
Remember me
Log in
Forgot your username?
Forgot your password?