iineo+ pick-and-place platform includes integrated component electrical tester, new operating system, multi-core processing and improved operator interface, as well as optional upgrades for enhanced traceability and system-wide ESD compliance.
NXT-H provides wafer, tray part, and reel part placement. High rigidity construction with linear motor movement and high-res cameras. Combines placing pressure, high accuracy and high quality using advanced control technology. HEPA filter provides a cleanroom class of 1000; XY robot is cleanroom capable. Is equipped with a 15" touchscreen panel and graphical interface. PCB load time is 4.3 sec. Accommodates printed circuit boards 48 x 48mm to 610 x 380mm.
VersaFlex-Ultra selective solder module features two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles.
X7056-II inline automatic 3D X-ray inspection machine features a new handling concept called xFastFlow for printed circuit boards change in as few as 4 sec.