Market Data

Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not include billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders. Compiled by Semiconductor Equipment Association of Japan, SEMI and SEMI Japan.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article