InterNepcon spotlighted advancements in automotive electronics, lighting and wearables.

Led by wearables, IoT will intensify the designer’s packaging choices.

ECTC showed fan-out wafer level packaging has many fans.

Cost remains king, even as buildup substrates take hold.

In the latest issue of the Global Semiconductor Packaging Materials Outlook, organic substrate represents more than one-third of the semiconductor materials market. The main reason for this high value is the growth of flip-chip substrates, which are typically more expensive than wirebond packages.