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Mike BuetowWe left off last month speaking about factory automation. Manufacturing in the US is always a hot topic, never more so than during the run-up to the presidential election last fall. (Oh, you didn’t hear about it? You will most definitely want to buy the book.)

By themselves, the numbers look good. The US manufacturing purchasing managers index, a barometer of the health of the industrial sector, has generally been moving up and to the right for years, according to the Institute for Supply Management. Over the same period, the Markit US manufacturing PMI has been solid as well. (Computer and Electronics Products is said to make up about 6% of the index.)
But when manufacturing is discussed, it’s generally with an eye toward employment. In other words, the thinking goes, the more product the US builds, the more people it will employ.

Not so fast.

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A dual Kanban approach cuts costs vs. Asia and ensures a predictable flow of finished goods.

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The PCB industry is overdue for modernization.

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Peter Bigelow

Familiarity breeds corner-cutting, with negative consequences.

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Halides present post-reflow can cause severe corrosion.

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Martin WickhamLess-than-optimal preheat can lead to moisture-related defects.

Typically, when copper, organic solderable protectant (OSP) coated boards are left exposed after soldering, the copper oxidizes and darkens in color. It will quickly become unsolderable but does not corrode. If exposed to activated flux residues that have not deactivated after preheat and soldering, it is possible to see green verdigis on the copper surface. FIGURES 1 and 2 show a printed circuit board that has been soldered, and the exposed copper on the topside of the board around the pad shows the green deposit referred to as green verdigris.

 

 

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