White Papers
LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.
ORLANDO – The DMSMS & Standardization Conference will take place here Nov. 26-29. It will include panels, briefings and training on the counterfeiting issue.
TAIPEI – Hon Hai (Foxconn) posted third-quarter net income up 58% to $1 billion.
MINNEAPOLIS, MN – The Surface Mount Technology Association said its membership recently elected Bill Barthel as president.
MANCHESTER, NH – EPTAC Corp. has appointed Brenda Clunie as vice president and operations director.
SURREY, ENGLAND – TT Electronics is forecasting milder profits in 2012 than previously expected, according to published reports.
WASHINGTON, DC -- The Center for Responsible Enterprise and Trade (CREATe) has released a white paper outlining the pervasiveness of counterfeit products within global supply chains.
Press Releases
- AIM Hires Bruce Gao as Sales Manager for South China
- Zero Defects International Doubles PCBA Testing Service Capacity
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High