AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.

The analysis also compares projected high-bandwidth memory (HBM) demand against planned capacity, noting widening gaps as AI accelerators scale. A dedicated section examines hybrid bonding adoption, equipment requirements, and competing fine-pitch interconnect approaches now entering development.

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