CLINTON, NY – Indium’s Ning-Cheng Lee, Ph.D., VP of Technology, and John H. Lau, Ph.D., CTO, Unimicron, coauthored Assembly and Reliability of Lead-Free Solder Joints.
The book covers Pb-free solder joints for advanced reliability across the food chain of electronics products.
The first edition, published by Springer, Singapore, is currently available in print and eBook forms. It explores both principles and engineering practices and provides a comprehensive overview of electronics products – from EMS on second-level interconnects, to packaging assembly on first-level interconnects, and the semiconductor backend on 3-D IC integration interconnects.
Chapters include information on solder joints in conventional and advanced packaging components, commonly used Pb-free materials, soldering processes, advanced specialty flux designs, characterization of Pb-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for Pb-free solder joints.
To purchase a copy, visit https://link.springer.com/book/10.1007%2F978-981-15-3920-6.