MORRISVILLE, NC – iNEMI is hosting a webinar based on the organic PCBs chapter of its 2019 Roadmap.

The Apr. 22 webinar, hosted by Steve Payne of iNEMI and Ed Kelley of Isola, will cover relevant market trends, key applications and other factors driving developments, plus current and future gaps impacting the industry.

The organic PCB chapter addresses the technology needs for all forms of PCBs and flex circuits. This webinar will discuss the growing complexity of components that drive the need for multilayer PCB constructions. The continuing trends for higher speed processors, coupled with technology developments such as 5G communications, will be highlighted, as these require specialized materials, in particular base laminates, as well as new fabrication techniques, such as mSAP, which will also be discussed. Considerations for dense packaging of electronics, including embedding passive and active components, are covered, as well as optical PCB challenges. Advanced technologies used for organic semiconductor packaging substrates will also be included, as their technologies are now being adapted for advanced HDI PCBs.

To register, visit https://tinyurl.com/rb7nttw.

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