TopLine Awarded US Patent for CCGA Fixture
Published: 03 March 2020
by Chelsey Drysdale
IRVINE, CA – TopLine’s CEO Martin Hart has been awarded a US patent for a fixture designed to deliver 1752 solder columns onto a substrate as part of the ceramic column grid array (CCGA) assembly process.
The patent was awarded Feb. 4.
TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on PCBs and provide more compliancy than solder balls to absorb stress and increase solder joint reliability under harsh operating conditions.
