SAN JOSE, CA – The IWLPC Technical Committee awarded the Best Presentation of Conference to Robert Hubbard, Ph.D., Lambda Technologies, for “Failure Relief in FOWLP Polymer Layers.”

Arnita Podpod, IMEC, won Best Paper of Conference for "High Density and High Bandwidth Chip-to-Chip Connections with 20µm pitch Flip-chip on Fan-Out Wafer-Level Package," which also won Best 3D Track Paper award.

The Best WLP Track Paper went to Jae Cho, Ph.D, GlobalFoundries, for "Chip Board Interaction Analysis of 22-NM Depleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)."

The Best Advanced Manufacturing Track Paper was awarded to Habib Hichri, Ph.D., SÜSS MicroTec, for "Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging."

Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.

The technical committee is currently accepting abstracts for the 2019 conference. Abstracts are due Mar. 1 and can be submitted at http://www.iwlpc.com/call_for_papers.cfm.

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