AOX755 flux-filled high-performance solder wires are based on two soft solder alloys filled with three cores of flux compound EO-FC-006.

Etimol defoamer DFL-100 and DFL-C anti-foaming agents can be used in machine-based cleaning to prevent uncontrolled foam development.

1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.

EO-Y-006 A and C fluxes consist of 60% alcohol and 40% water.

YRM20 high-speed modular mounter features high-speed rotary head that achieves up to 115,000cph. 

PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.

Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.

DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.

TR8100H SII high-density pin count in-circuit tester with vacuum fixture targets low-voltage testing market.

VR-6000 3D optical profilometer is designed with built-in motorized rotational unit.

Draloric TNPV0805 automotive-grade high-voltage thin-film flat-chip resistors combine operating voltages to 450V with tolerance of ±0.1% and TCR down to ±10 ppm/K.