Delo-Dot PN5 microdispensing valve has dispensing frequency up to 300Hz.

3Di inline AOI system is for inspection of high-density printed circuit boards and boards with combinations of small and tall components.

Unit-i1 compact inline selective soldering machine is less than 55" in length.

EO-B-023 A to E series fluxes are identical to EO-FC-006 filling compound used in tubular solders.

Structalit 5705 removable edge bonder is formulated for bonding consumer electronics components.

Critical Manufacturing manufacturing execution system v. 9 uses manufacturing-specific DevOps Center to enable software to be deployed to multiple plants located anywhere.

LineMaster Falcon Plus inline platform combines VisionPro Merlin Detech2 image- and algorithm-based AOI sensor/software technology.

PowerCu soft laser copper ribbons are for laser bonding in power electronic systems.

PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.

V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.

Alpha HRL3 solder sphere is a lead-free, high-reliability, low-temp. alloy for ball-mount applications.

EO-S-002 solar flux has 2% solids and low resin content.