Uni-form epoxy preforms are available in M5-82, a linear epoxy system that remains flexible under temperature changes. Post-cure flexibility said to improve adhesion to component materials with dissimilar coefficients of thermal expansion. Developed for under-the-hood automotive applications and other environments that require seal integrity under adverse temperature conditions. Are one-part epoxy resins solid at room temperature. Melt and cure when heated, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Close tolerances on preform dimensions; consistent pre-mixed ratios of resin to catalyst; and consistent viscosity from beginning to end of batch ensure uniform. Available with outside diameters from 0.035" to 0.720". Can be dispensed as rapidly as 200 to 600 parts per minute. Said to eliminate pot-life concerns and cleanup procedures.
 
Multi-Seals, www.multi-seals.com
 

Medalist i1000 offers the VTEP v2.0 vectorless test suite, which comprises iVTEP and network parameter measurement technology. Reportedly offers unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors found in digital consumer products and desktop PCs. Is compatible with most MDA fixtures. An AutoDebug feature slashes debugging time to a few hours. Comes with an automatic node-guarding feature that is said to eliminate the need for manual checks of schematics for guard points. Offers two fixture options. Provides fast fixture-swapping time while maintaining high signal integrity. Available in June.
 
Agilent Technologies, Inc., www.agilent.com/see/i1000.
 
 

 
Juki Corporation, www.jas-smt.com

 

The Medalist x6000 AXI reportedly reduces manufacturing conversion costs without compromising defect-detection capability. Is said to more than double the throughput of market-leading 3D solutions. Reportedly the only one to deliver high-throughput 3D coverage that can be used to inspect the entire board. Said to reduce implementation barriers caused by high employee turnover in outsourced regions by providing a new development environment that incorporates several automatic test development features that help new users to develop high-quality programs in half the time previously required. Ready to ship in May 2007.
 
Agilent Technologies, www.agilent.com
 

NSpec Linea DL20 is for post-print, -placement or -reflow inspection. Is reportedly quick to program and debug, and a comprehensive stamp library shortens inspection time. Features full-color inspection and a low false call rate. For post reflow inspection, comes with multiple illumination techniques, including a diffuse on-axis light module.

PCB pad repair kit and associated repair materials include “how to” slides, a large selection of different pad sizes and tools required to make repairs. Designed to reduce time spent trimming pads located on circuit frames.

Kimtech Pure presaturated alcohol wipes dispenser provides one-handed dispensing with no need to hold a package or re-seal a closing flap. Features a self-closing, self-sealing lid that helps prevent dry-out of wipers; an extractor arm that automatically lifts each wiper for easy pickup without damaging the wipers; and a durable design that generates no particles and makes refilling easy.

DispenseJet DJ-9000 reportedly dispenses precise amounts of wax onto discrete locations on a chip, keeping biological test fluids in place and contaminant-free. Can jet fluids into spaces as tight as 175 µm, and reportedly achieves fillet sizes of 300 µm, dot diameters of 0.20 mm, shot volumes of 1.0 nL, and a jet stream size as small as 50 µm. Jets fluids with viscosities from 1 to 250,000 cps. Is automated, noncontact, and can be used for lab-on-a-chip applications in all stages of development and manufacturing.

Essemtec, www.essemtec.com