Circuits Assembly Online Magazine - News

Products

No. 955 is a 500ºF (~260ºC) electrically heated, top-loading oven for testing electronics components. Workspace measures 312" x 24" x 24". 70KW are installed in Nichrome wire elements to heat the oven; 8000CFM total from a series of four 2HP recirculating blowers provide horizontal rear to front airflow. Has 4" insulated walls, aluminized steel exterior and interior, a motor-operated rear-hinged door opening the top and front, and a workspace floor reinforced for 7200 lbs. loading onto the 1/4" steel plate surface. No. 998 features digital programming temperature controller with two channels. Has two manual reset excess temperature controllers with separate contactors and four recirculating blower airflow safety switches.

Grieve Corp., www.grievecorp.com

Manufacturing Suite (AMS) Release 2.0 is said to optimize production line performance of pick-and-place machines. The open architecture package brings connectivity to factory automation software and enterprise-wide networks. Customers can use their own line and machine optimization software, or buy a complete package. Defect rates are reportedly lower. Supports SMT manufacturing processes from data preparation through to parts warehousing. A variety of CAD and BoM formats can be imported and edited. Line control allows a single-click product changeover. Parts library management provides central data storage of part/vision/feeder information and placement programs.

Assembléon, www.assembleon.com

FLX2010 SMD pick-and-place offers 190 feeders and the possibility of feeder changeover during operation. Said to reach a placement rate of 5,000 cph. Places components such as 0201 or ultra fine pitch 0.3 mm. Features a combination of laser and vision centering systems. Component range includes tall condensators (height up to 15 mm), large connectors and BGAs with 50-mm side length. LEDs show feeder status and notify the operator if a min. quantity is reached. The feeder setup control system is based on barcode identification. Programming can be prepared offline during running production. CAD data in any format can be imported; the board is graphically displayed before production. Placement can be controlled virtually.

Essemtec, www.essemtec.com

Free simulation design kits assist with the integration of Altera’s Arria GX FPGAs onto PCBs. Arria GX FPGA transceiver-based devices are said to be ideal for applications where the technology is moving rapidly with short design cycles, such as communications, computer, storage and industrial.

A set of topology templates makes routing to JEDEC-defined signaling standards such as SSTL 1.8V a straightforward process. The kit reportedly makes it easy to compare real-board performance against the theoretical ideal, using waveform and eye pattern analysis, in addition to simulation models. It allows users to view results in both time and frequency domain, displaying both voltage and current.

Zuken, www.zuken.com/linkz

Hysol QMI5100 and Hysol QMI5200 are dicing die attach films designed to streamline the die attach process, particularly for stacked die applications. Combine properties and functions of die attach film and dicing tape into one product; dual structured materials. Reportedly only need to laminate film to backside of wafer; dice the wafer; pick the die and move to die placement; leave no burrs after dicing; eliminate common bleed issues. Said to remove the need for dispensing or curing equipment or process steps. QMI5100 is 10 µm thick material. QMI5200 is available in a thickness of 20 µm; approved for use on DA1 and/or DAX. Primarily for flash and DRAM devices. Die placement down to 0.1 sec. Formulated as pressure sensitive release materials.

Henkel Corp., www.henkel.com/electronics

KIC Explorer is a thermal profiler with a miniature-TC harness design. Said to move easily through restrictive process dimensions; incorporates high-temperature rated components; has 12 thermocouples. Reportedly provides highest sampling rate available and greater memory capacity. Measures slope, peak temperature, time above liquidous and the Process Window Index statistic. Manual prediction capability comes standard. Auto-Focus is optional.

KIC, www.kicthermal.com

Hysol QMI708 die attach paste has been formulated specifically for small die on copper leadframes. Has been developed to attach die 2.5 mm x 2.5 mm and smaller in QFN and SOIC packages. Said to be highly conductive, with low bondjoint resistance. Reportedly dispenses quickly with no tailing; is simple to set up, and allows for a wide dispense window.

Henkel, www.henkel.com/electronics

The Peltier series Thermoelectric Temperature Controller controls fluid temperature of adhesives, sealants, lubricants and other materials in meter, mix and dispensing systems. Uses Peltier-Seebeck effect to directly convert electrical voltage to thermal differentials. This effect, which is reversible, is said to either heat or cool fluid materials with precision to the temperature set point. Device, temperature sensor and temperature control are mounted to a manifold where fluid passes through. Manifolds can be mounted inline or on fluid dispensing equipment. May also include accessories such as fluid pressure sensors, fluid pressure gauges and inlet and outlet flow control valves.

Sealant Equipment & Engineering, www.SealantEquipment.com

EasyPro3D programming software is said to offer simplified inspection-routine parameterizing, a fully IPC-compliant LIB2007 inspection library, and a newly designed repair station. A shortened parameter list reportedly allows high-inspection quality and low false alarm rates. A reworked standard delivers compact, preset, IPC-compliant parameter sets, reducing the number of parameters that need to be adjusted by a reported 75%. Contains nearly 1,600 component types. Automatic Parameter Optimization can now be used with nearly all inspection algorithms. The repair station contains a ”ValidCompare” mode. For every defect image recognized, another defect-free image is offered. Includes integrated “TrustedChange” verification.

Viscom, www.viscom.com

SEMTest is a configurable stress-screening system able to perform lifetime testing of power semiconductors and modules incorporating IGBT, MOSFET, SCR, diode and bipolar parts. Is said to be ideal for manufacturers and users of power semiconductors who want to qualify commercial off-the-shelf devices for use in high-reliability applications. The core is a flexible architecture that can be modified. Standard systems can be configured from 20 to 1000 test cells; larger systems are available on special order. Each cell features its own local controller to set and monitor applied or UUT power and other test parameters; has a measurement unit for temperature, current, voltage, and timing.

Intepro Systems, www.inteproate.com

The latest versions of PCB transfer conveyors and PCB inline work stations include the 600 mm single drive transfer conveyor, a 1000 mm dual drive transfer conveyor, and a full feature 1000 mm dual drive workstation.

Promation Inc., www.Pro-mation-Inc.com

CION Module/DIMM168 is a digital module serially controlled via TAP by CION ASIC chips. Said to enable testing of all signal and voltage supply pins of JEDEC Std.-compliant DIMM168 plug connectors. Is plugged into a socket, whereby interface stages’ voltage between 1.8V and 5V are adapted automatically. Several boards of the same or different types can be cascaded in a daisy chain configuration. All channels can be independently switched as Input/Output/Tristate. Provides special safety mechanisms.

Goepel Electronic, www.goepel.com