Sarcon GR-H and XR-H thermal interface gap pads are said to simplify board-level maintenance by reducing material tearing during disassembly for rework and repair. Are manufactured with a hardened top surface. One-sided surface treatment is less tacky than the opposing contact side, permitting the thermal pad to consistently adhere to the electrical component or opposing heat sink. Release from component without tearing or damage. Are available in eight different formulations; offer thermal conductivity from 1.2 to 17.0W/m°K. Sarcon Hardened Surface conforms to uneven components. Gap fillers are available in sheets with thicknesses from 0.5 to 5.0 mm to 200 x 300 mm.
Fujipoly America Corporation, www.fujipoly.com
Marantz Business Electronics, www.marantz.com/bus/eu
Siplace SX has a modular gantry that can be replaced in less than 30 min. with an easy-to-use changeover system. Makes placement performance and capacity individually scalable in line with demand. Comes with 12-nozzle MultiStar placement head with CPP (Collect & Pick & Place) technology, which switches automatically to the most efficient placement mode. Is compact and said to be easily reconfigurable.
Siemens Electronics Assembly Systems, http://ea.automation.siemens.com
SelectaFlux Retrofit ultrasonic selective fluxing system has been designed to retrofit into all major selective soldering machines and is said to be compatible with all flux types, including Pb-free. Requires a simple trigger signal to operate and has controlled velocity spray. Combines Microspray ultrasonic atomizing nozzle with low air pressure. Spray is restricted through a separately controlled module that handles input and output. The distance between the nozzle and substrate can be varied from near-contact to approximately 50.8 mm. Contains a digital display for nozzle power and panel-mounted nozzle power, flow rate and air pressure adjustments, plus an alarm output for nozzle malfunction. Is 432 mm width x 305 mm height, and 221 mm diameter.
Sono-Tek, www.sono-tek.com