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The Unicon 108XL high-power soldering iron is for high mass soldering applications, including printed circuit assembly, industrial and solar cell manufacturing. Is available in 150 and 300 W versions. Uses a high mass soldering tip. Features are said to include precision control, fast recovery time, and the ability to use solder wire up to 2 mm diameter.
 
Christopher Associates, www.christopherweb.com

LPKF Stencil Laser P 6060, for SMT stencils production, is fully enclosed. Uses a lightweight motion system said to permit excellent positioning accuracy, while maintaining high cutting speeds. Can cut all stencils, both framed and frameless; can be adjusted to fit any stencil size up to 29.1" x 37.4". Requires minimum setup. Features a fiducial camera for automatic reload. Can cut with compressed air and oxygen. Can be remotely serviced via Internet.
 
LPKF Laser & Electronics, http://www.lpkfusa.com
 
The RO06-PLUS batch oven offers Pb-free soldering capability and curing programs with durations up to 18 hrs. Features integrated microprocessor control and fully automatic processing. Applications include prototyping, small batch manufacturing and testing. Integrated microprocessor control provides a large set of predefined soldering and curing programs. Includes free memory for other temperature profiles; temperatures up to 300°C can be stored. Large-view window permits observation. Has process pausing function. Process can be extended manually. Can measure temperatures directly on the processed materials by thermocouples. Zone and material temperatures are shown on LCD or transmitted via an RS232 interface to external software. Consists of two process zones: a sealed heat chamber and an open cooling section. A motorized drawer drives the substrates between the two zones. Hot process chamber includes a full convection heating system.
 
Essemtec USA, www.essemtec-usa.com
The RFID Smart Storage Cart for Juki feeders complements the IFS-X2 intelligent feeder system. Provides the capability to automatically detect all Juki intelligent feeders in offline storage carts. Come in a range of feeder storage options, with or without intelligence.
 
Cogiscan, www.cogiscan.com  
Juki Automation Systems, www.jas-smt.com
 
Atron SP 200 reportedly effectively removes all screened Pb-free flux residues on standard solder pallets at concentrations of 10 to 20% at different operating temperatures. Is surfactant-based; bath life is said to be up to 10 times longer compared to conventional surfactant-based cleaners. Full material compatibility demonstrated across various manufacturers. Is halogen-free and environmentally friendly. Meets RoHS and WEEE guidelines.
 
Zestron America, www.zestron.com  
 
The LED Production Systems brochure contains comprehensive information on production and processing of LEDs. The eight-page document includes information about manufacturing lenses at board level, phosphor-encapsulation, and assembling of LEDs on flex-boards. Outlines processes and shows the application possibilities of dispensing systems, placement machines, solder and curing systems.

Essemtec, www.essemtec.com 
Friendlygreen.org was created to offer commercial clients alternatives in sustainable, green technologies and operational efficiency enhancements. Provides information on earth-friendly alternatives to industry standard products. Will introduce proven, point-up strategies to assist in reducing daily operational costs and extending the lifecycle of equipment and procedures.
 
High-Tech Conversions, www.friendlygreen.org  
 
SX45 stereo zoom microscope reportedly has long-life LED illumination. A trinocular viewing attachment may be used; a digital or USB camera is optional. Multimedia solutions are available for image archiving, acquisition, processing, analysis and documentation. Other options include bench stand, boom mount, and articulated arm. Has a zoom ratio of 6.3:1 and a magnification of x50.
 
Vision Engineering, www.visioneng.us
Weller WHP200 under-board heater is designed to speed up repair of small multilayer PCBs. Is said to offer easy temperature adjustment. An infrared plate provides controlled heating. Set temperature and actual temperature are digitally displayed. Includes a PCB board holder.

Cooper Tools, www.coopertools.com  
 
Sarcon XR-Pe is a putty-like thermal interface material. Is said to help improve semiconductor performance by transferring unwanted heat to a nearby heat sink. Is silicone-based and conforms to most CPU and semiconductor shapes with a low compression force requirement. Is maintained for applications that require up to 90% material compression. Reportedly offers thermal conductivity of 11 watt/m-k with a broad operating temperature from -60°C to +200°C. Is available in 2.0 or 1.5-mm thick sheets up to a maximum dimension of 300 mm x 200 mm. Can be ordered in die-cut form.

Fujipoly America Corp., www.fujipoly.com

Manual Tip-Seal Kiss dispense valve is said to be ideal for dispensing low- to high-viscosity one-component adhesive and sealant materials such as silicone or polyurethane. Is used in repetitive fluid dispensing applications. Pistol grip assembly has an electric trigger with a guard and foam grip. Can be set to close valve for visual dispensing or automatically close the Tip-Seal valve for precision-metered volume of material. Is said to be ideal for dispensing solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Has carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals.
 
Sealant Equipment & Engineering Inc., www.sealantequipment.com
AlSiC (Aluminum Silicon Carbide) is a metal matrix composite packaging solution for traditional hermetic packaging applications. Is said to have a lower density value – 1/5 to 1/6 lighter in weight than CuMo and CuW, respectively – yet similar thermal conductivity and expansion coefficient. Designs reportedly are cast to the final shape, requiring no secondary machining. Net-shape casting capability enables direct creation of functional design features, such as pockets for circulators and cavities or pedestals for the die. A hermetic package assembled with an AlSiC base brazed to an alloy 48 frame is hermetic to better than 10-9 atm-cm3/s. Is RoHS compliant.
 
CPS Technologies Corp., www.alsic.com
 

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