Tecnomatix 10 is a manufacturing solution built on open technologies. Provides visibility into manufacturing decisions, analyses and results with productivity tools, an intuitive user interface, and a seamless connection to machine controllers. Plans, optimizes and validates manufacturing processes before starting production. Can synchronize product and process development stages. Can reuse existing manufacturing data and process knowledge. Identifies potential errors early and analyzes impact of changes. Has iterative analysis. Validates planned operations before reaching shop floor. Virtual commissioning allows for interaction between virtual production model and physical production equipment.

Tecnomatix, http://www.plm.automation.siemens.com/en_us/products/tecnomatix/tecnomatix10/index.shtml

Tecnomatix 10 is a manufacturing solution built on open technologies. Provides visibility into manufacturing decisions, analyses and results with productivity tools, an intuitive user interface, and a seamless connection to machine controllers. Plans, optimizes and validates manufacturing processes before starting production. Can synchronize product and process development stages. Can reuse existing manufacturing data and process knowledge. Identifies potential errors early and analyzes impact of changes. Has iterative analysis. Validates planned operations before reaching shop floor. Virtual commissioning allows for interaction between virtual production model and physical production equipment.

Tecnomatix, http://www.plm.automation.siemens.com/en_us/products/tecnomatix/tecnomatix10/index.shtml

Checker 4G7X line consists of position tools, colored lighting and filters, and a new sensor model. Is part of Checker 4G machine vision sensors. Offers a pattern-based position tool that supports 360° rotation to verify object location regardless of its position on the production line. Position tools inspect cap height and skew, label position, fill level, web position, and component placement. Includes colored lighting and filter options that help optimize image contrast and bring out more features to inspect regardless of factory conditions. Has integrated polarization windows that remove specular glare from images featuring highly polished or reflective surfaces.  Can simultaneously check for presence, size and position of features on one part. Integrates into factory network and communicates with PLCs.

Cognex, www.cognex.com

SN100C (551CT) Pb-free solder combines high-reliability alloy (SnCu0.7Ni0.05+Ge) with a sustained activity core flux. Core flux is for use with soldering tip temperatures up to 380°C; ensures good tip separation. Reduces icicling by 90% and spattering by 95% over previous formulations. Silver-free SN100C alloy has stable microstructure to accommodate long-term cyclic strain and impact loading. For sequential soldering and rework.

Nihon Superior, www.nihonsuperior.co.jp

iSpector Island automatic optical inspection combines iSpector benchtopAOI with full automation. Queues incoming printed circuit boards and sorts into “known good” or “to-be-verified.” Data are downloaded to optional verification station for more efficient tracking and sorting. Works in “lights out” environments. Features 24-bit full-color imaging software, nine-camera hardware, robust algorithms, rapid programming and low false call rates.

Marantz Business Electronics, www.escapethegreyworld.com

Christopher Associates, www.christopherweb.com

iSpector Island automatic optical inspection combines iSpector benchtopAOI with full automation. Queues incoming printed circuit boards and sorts into “known good” or “to-be-verified.” Data are downloaded to optional verification station for more efficient tracking and sorting. Works in “lights out” environments. Features 24-bit full-color imaging software, nine-camera hardware, robust algorithms, rapid programming and low false call rates.

Marantz Business Electronics, www.escapethegreyworld.com

Christopher Associates, www.christopherweb.com

Alpine OT2 solder paste contains a flux medium said to eliminate defects related to oxidation and miniaturization. Flux is halogen- and halide-free, and for use with SN100C, SCANGe-071 or SAC305. Is rosin-based and prints at high print speeds (>200 mm/sec). Paste is said to eliminates head-in-pillow defects, and shows no graping or defects.

Cobar Solder Products/Balver Zinn, www.cobar.com

Alpine OT2 solder paste contains a flux medium said to eliminate defects related to oxidation and miniaturization. Flux is halogen- and halide-free, and for use with SN100C, SCANGe-071 or SAC305. Is rosin-based and prints at high print speeds (>200 mm/sec). Paste is said to eliminates head-in-pillow defects, and shows no graping or defects.

Cobar Solder Products/Balver Zinn, www.cobar.com

The 34-gauge dispense tip has an inside diameter range of 0.003" - 0.0045". Is ideal for dispensing micro shots of low-viscosity fluids. Consists of electro-polished stainless steel cannula and double helix polypropylene hub. Is silicone- and chloride-free. Is available in bulk quantity and packs of 50 pieces.

Techcon Systems, www.techconsystems.com

Mini-Oven Reball/Solder Bumping unit 04 provides controlled air circulation; hot air continually flows around the component, heating it equally from all sides. Offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine-tune parameters. Reballing function is capable of handling diverse range of BGAs, as well as QFNs and CSPs. Rapid Technology soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain a safe temperature zone. Is ideal for the complete QFN solder bumping process. Uses Hotprint Technology; mask remains on the QFN during reflow.

Martin, www.bgarework.com

Mini-Oven Reball/Solder Bumping unit 04 provides controlled air circulation; hot air continually flows around the component, heating it equally from all sides. Offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine-tune parameters. Reballing function is capable of handling diverse range of BGAs, as well as QFNs and CSPs. Rapid Technology soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain a safe temperature zone. Is ideal for the complete QFN solder bumping process. Uses Hotprint Technology; mask remains on the QFN during reflow.

Martin, www.bgarework.com

16.350 wave solder machine can be configured with two pots on rollout carts to provide lead and Pb-free soldering. Solder pot capacity is 200Kg. Is fewer than 5.5’ long and includes 350mm-wide adjustable finger conveyor with built-in cleaner and a 600mm preheat tunnel with forced hot air convection. Features motorized inlet conveyor and motorized spray to evenly distribute flux.

Manncorp, www.manncorp.com