Indium's high-reliability gold-based PDA preforms offer a high level of precision to reduce defects, control bondline thickness, and deliver high-yield performance and reliability in critical die-attach applications.

Kyocera AVX's line of KAM Series automotive MLCCs now includes 20 new components.

Master Bond's Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation.

Stackpole's CSFA series automotive-grade high-current SMD jumpers are capable of handling currents up to 70.7A with overload current ratings reaching up to 158A.

Mek's ISO-Spector S3 series of 5-D solder paste inspection systems offers a comprehensive suite of advanced features.

Stackpole's HVCR is a high precision, low VCR chip resistor with high stability.

Würth Elektronik's portfolio of digital isolators now features a two-channel version in a SOIC 8WB package (5.85 x 11.5 x 2.8 mm).

Indium's PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Aven’s new diagonal cutters are crafted to provide superior cutting capabilities and longevity, making them ideal for a wide range of industrial tasks.

Master Bond's UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.

TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.

Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.