No.942 is a gas-fired, 350ºF walk-in batch oven currently used for curing epoxy. Workspace dimensions measure 84" x 144" x 108". 400,000 BTU/HR are installed in a modulating natural gas burner, while 12,000 CFM total from two 5 HP recirculating blowers provide combination airflow to the workloads. Features 4" insulated walls throughout, aluminized steel interior and exterior, three independent doors on the front of the oven, standard double doors on the rear of the oven, 2" insulated floor with three pairs of built-in truck wheel guide tracks and 6" I-beam supports. Includes a 325 CFM, 1/3 HP powered forced exhauster, dampers on the intake and exhaust for accelerated cooling, as well as a 10" diameter circular chart recorder and digital programming temperature controller.   

The Grieve Corp., www.grievecorp.com

XT-6 x-ray inspection machine features hexapod-manipulator for detailed, extreme x-ray transmission angles. Inspects electronic components, double-sided PCBs, complete modules, casting parts and medical implants. Can be equipped with an automatic load/unload or for CT configuration. Permits free and flexible movements on all axes based on a parallel-kinematic hexapod manipulation unit. Six axes motion unit move flexibly with one hand via space mouse navigator in vertical and horizontal direction and around 180°. Standard system setup is suitable for inspection dimensions up to 400 x 400mm; XL configuration for up to 550 x 550mm is optional. Can be equipped with different x-ray tubes up to 160kV and detectors. Provides up to 4 x-ray images per second in transmission mode. For laboratory inspection and automatic small series production. Comes with a Planar CT reconstruction setup and CT visualization software. Automatic load/unload with an in/out shutter system.

MatriX Technologies, www.m-xt.com

XT-6 x-ray inspection machine features hexapod-manipulator for detailed, extreme x-ray transmission angles. Inspects electronic components, double-sided PCBs, complete modules, casting parts and medical implants. Can be equipped with an automatic load/unload or for CT configuration. Permits free and flexible movements on all axes based on a parallel-kinematic hexapod manipulation unit. Six axes motion unit move flexibly with one hand via space mouse navigator in vertical and horizontal direction and around 180°. Standard system setup is suitable for inspection dimensions up to 400 x 400mm; XL configuration for up to 550 x 550mm is optional. Can be equipped with different x-ray tubes up to 160kV and detectors. Provides up to 4 x-ray images per second in transmission mode. For laboratory inspection and automatic small series production. Comes with a Planar CT reconstruction setup and CT visualization software. Automatic load/unload with an in/out shutter system.

MatriX Technologies, www.m-xt.com

Selecta AOI machine serves the selective solder and wave solder processes. Is a “look up” system; imaging is performed on the underside of the printed circuit board assembly. Is capable of inspecting up to 18" x 14" boards. Is configured with a 64-bit operating system and eight cores of processing power. Includes options for automatic database generation from various input sources without 3d party data translators.

Machine Vision Products, www.machinevisionproducts.com

A500X is a faster version of the fully-automated A500 benchtop solder paste inspection machine. Uses structured light scanning technology for 3D reconstruction. Has a laser stripe to compensate for board warpage and for dynamic focusing.

VisionMaster, www.visionmasterinc.com

The 3D function in the AOI XM camera module has a structured light projector and a multistep laser triangulation procedure; projection is picked up by four or eight side-looking cameras. Has an image acquisition rate up to 1.8GP/sec. Also uses existing angular AOI cameras.

Viscom, www.viscom.com

Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.

Dow Electronic Materials, www.dowelectronicmaterials.com

Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.

Dow Electronic Materials, www.dowelectronicmaterials.com

LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.

Indium Corp., www.indium.com

LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.

Indium Corp., www.indium.com

EVS 500 dross recovery machine dispenses with air-driven pistons and inverts solder/dross separation pot. Adds 180° rotating facility. No teeth are used to separate solder/dross. Is fully automatic. Offers same safeties and locking systems of EVS 8K/10K models. ISO 14001 compatible. Can help reduce dedrossing time by 75% and waste dross off-site by up to 85%.
   
EVS International, www.solderrecovery.com

EVS 500 dross recovery machine dispenses with air-driven pistons and inverts solder/dross separation pot. Adds 180° rotating facility. No teeth are used to separate solder/dross. Is fully automatic. Offers same safeties and locking systems of EVS 8K/10K models. ISO 14001 compatible. Can help reduce dedrossing time by 75% and waste dross off-site by up to 85%.
   
EVS International, www.solderrecovery.com