Multi-ɸ variable laser spot diameter system optimizes laser exposure diameters to fit any component size or board patterns. Laser beam spot diameters are adjustable without moving. Beam spot diameters adjustable within 0.1-3.0mm. Diameter range determined by optical fibers and lens configuration. Variable spot diameters accommodate diverse component shapes and land patterns. New feeding mechanism feeds solder wire from any direction. Mixed-component assembly PCBs now can be processed with just one machine. Replacement laser heads are now available for existing laser soldering customers.

Japan Unix, www.japanunix.com/en/products/laser/multi-phi.php

Place-n-Bond underfilm is now offered with glue dots preapplied to the strip as an alternative for tacky pads. Testing now integrates into a standard SMT feeder. A thinner version of underfilm helps improve LGAs during shock, drop, and thermal cycling testing. Is a preformed thermoplastic packaged in tape and reel that is picked and placed with an existing SMT feeder. Bonds during reflow process and can be used in BGA reliability, flex-circuit-to-rigid-board bonding, encapsulating, and sealing. No dispensing, additional cure time or cold storage is required.

Alltemated, www.alltemated.com

Master Bond EP21TPFL-1AO is an electrically insulative two-part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft²•hr•°F. Reportedly has good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. Is for bonding, sealing, coating and encapsulation applications in the electronic, aerospace, OEM and related industries. Has an elongation of 150-200%; can withstand thermal cycling and mechanical shock. Has low viscosity and a hardness of 70-90 Shore A. Color coding facilitates mixing. Part A is black and Part B is off-white. Working life is 90-120 min. at 75°F. Fully cures at ambient temperatures and should not be heated. Has good adhesion to metals, ceramics, composites, glass, and many rubbers and plastics. Is serviceable over range of -60°F to +250°F and has a six-month shelf life in original, unopened containers.

Master Bond, www.masterbond.com

Mantis Elite-Cam HD now features high definition video for enhanced optics and greater resolution. Bundled with novel software and HD USB camera for image capture and annotations. Image capture (.bmp, .jpeg, .png) and video recording (.avi) make it useful for training. Patented optical technology for fatigue-free viewing and image quality with up to 20x magnification Superb hand-eye coordination for inspection and manipulation tasks

Vision Engineering, www.visioneng.us

Black and TrueWhite laser markable labels are tested to GMW14573 and GM6121M performance requirements for automotive label applications. Can be ablated by a variety of low power lasers, provide flexible, high-temperature alternatives to polyester and acrylic laser markable labels and are durable. Include high-temperature polyimide films, durable cross-linked polymer coatings, low surface energy pressure-sensitive adhesives and liners for handling and die cutting. Can be ablated by most low-power CO₂, YAG, fiber, UV and Vanadate lasers. Adhere to metals, plastics, glass, ceramics and resins.

Polyonics, www.polyonics.com

VisionMaster 6.0 software, for desktop SPI systems, performs 3D measurements and plots printed circuit board features. Upgrades include negative height measurements, pad array creation with an intuitive user interface, and improved processing algorithms. Touchscreen support for Windows 8/10 has been extended and updated. Features charting. Built-in SPC support provides process capability data range selection and better upper and lower limit control, and color palette-based threshold entry. Removes unwanted data points for charts, expands support for external SPC packages, like Siemens' Criterion and Minitab, and performs multiple 2D measurements. Measures object width, height and diameter. Draws measurement templates on any object in the field of view of the sensor.

VisionMaster, www.visionmasterinc.com

Optymo 4.4 BoM and parts management software features enhanced quotation module that allows fast sending of RFQs and price and lead-time comparisons. "Min/max" feature now rapidly computes unit and total costs for various quantities of a given BoM, calculates excess costs and remaining components, depending on volumes and packaging. Presents results in graph format. Integrates a relational datase based on a client/server structure. Includes faster data transfer. 

Inlynk, www.inlynksoft.com

XP series syringe adapters use 5/32" OD tubing for ease of handling and maneuvering. Permit pressurization of a syringe to dispense a metered amount of material ergonomically and with precision. Come in 3, 5 10, 30, 50cc sizes as well as an option for 6' tubing length. Fits all Jensen Global air syringes as well as many other manufacturers' syringes. Come with standard black quick connect barb fitting or white quick connect fitting that plugs right into novel digital dispenser systems.  

Jensen Global, www.jensenglobal.com

Hybrid 3 chip placer has a placement accuracy of less than 10µm, for wafer-level packaging, FOWLP, SiP, MCM, flip-chip, modules and embedded components. Places both die and passive components. Based on high-speed AX/iX product family.

Kulicke & Soffa, www.kns.com

PCB Rax printed circuit board holder is for repair, prototyping and assembly. Is designed to hold odd-shaped boards, even round ones. Accessory slots (open T-slots, allow the addition of various accessories. Customizable. Uses standard connecting hardware. 

PCB Rax, www.kickstarter.com/projects/1428014401/pcb-rax-an-easy-to-use-circuit-board-holding-syste

RACS (reducing agent: coke substitute) waste reprocessing technology processes contaminated trash into a carbon-rich reducing agent used to make pure metals and profits from dross and oxides. Waste stream is generally comprised of understencil wipes, spent paste, tubes and jars, gloves, rags, finger cots, and other similar items.

Conecsus, www.conecsusllc.com

CA-180 low-temperature cure conductive adhesive is for die attach and general circuit assembly applications. Cures in 30 min. at 80°C, three min. at 100°C, or 10 sec. at 150°C with an electrical conductivity of 4 x 10^-5ohm-cm. Reportedly ideal for applications in which components are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work life and a 12,000 cP viscosity at 5 rpm. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems, www.emsadhesives.com