Microfocus x-ray tube XWT-300-THE Plus is for 3D production testing and measurement. Has 300kV acceleration voltage and 50W target power. Developed for industrial computed tomography and measurement applications. Features internal cooling of transmission target and diamond-based transmission target that delivers intensity at acceleration voltages above 225kV. Permits JIMA resolution of 3µm with voltage range from 50kV to 300kV.

X-ray WorX, www.x-ray-worx.com

TGA 2 features XP micro- and XPU ultra-microbalances. Thermogravimetric analyzer measures up to 50 million resolution points down to 0.1µg for a 5gm sample weight. Reportedly guarantees reproducible results independent of environmental conditions. Each instrument can be configured according to requirements of intended use. Can be upgraded as needed.

Mettler Toledo, www.mt.com

DSC 3 uses a FRS 5+ DSC sensor with 56 thermocouples for thermal analysis. Reportedly provides high sensitivity and excellent temperature resolution. Is chemically resistant with a ceramic surface. Has a signal time constant of 1.8 sec. Sample robot can process up to 34 samples; can pierce lid of hermetically sealed aluminum crucibles immediately before measurement. Can start measurement with one click. Has touch-screen terminal without use of PC. FlexCal technology automatically applies correct calibration parameters to match specified heating rate, purge gas and crucible type. Options include combination of DSC with microscope or usage of photo calorimetry accessory.

Mettler Toledo, www.mt.com

JT-Q hot air station without extractor desk repairs all types of SMD, including large QFPs and PLCCs. Features two work modes, manual or program, to manage temperature and hot air flow. Can personalize more than 20 parameters, including activation mode of the tool: automatic, by button or by P-005 Pedal. Works with JT-TA heater and features a USB-B connector for software updates. Comes with JT-SD stand that guarantees auto-stop function when tool is at rest.

JBC Tools, www.jbctools.com

Platoshear S extra-strong cutter is engineered to trim higher gauge leads and wire without blade nicking or dulling. Cuts up to 15 AWG copper wire (0.06"/1.5mm). Is 50% thicker wire than Platoshear 170. Plato cutter uses shear cutting method, which reportedly requires 50% less operator effort; extends cutting life. Thin profile design is ideal for trimming hard-to-reach areas. Handles are cushioned; automatically spring back to original position after each use.

Techspray, www.techspray.com

JT hot air station repairs all types of SMD, including large QFPs and PLCCs. Features two work modes, manual or program, to manage temperature and hot air flow. Can personalize more than 20 parameters, including activation mode of the tool: automatic, by button or by P-005 Pedal. Works with JT-TA heater and features USB-B connector for software updates. Comes with complete extractor desk and JT-SD stand; guarantees auto-stop function when tool is at rest.

JBC Tools, www.jbctools.com

Newhorizon pulsed heat reflow soldering system is for flex to ceramic, component to printed circuit board, flex to PCB, wire to PCB, and leadframe to PCB. Uses Uniflow 4 pulse heated reflow soldering power supply; hot-bar reflow soldering system provides integrated heat process control. Includes pneumatic bonding heads and 2-D or 3-D thermodes, X-Y thermode planarity adjustment, electronic temperature and system control, and digital bond force readout. Features active integrated cooling for heavy duty cycle operation. Is mounted on an adjustable frame; includes front-rear linear slide and manual or pneumatic rotary tables. Process parameters are embedded. Options include optical plug-and-play alignment modules and an interposer module for both Kapton and Sarcon tape in manual and automatic configurations.

Amada Miyachi America, www.amadamiyachi.com

Vigon RC 303 is a water-based cleaning agent developed for the removal of baked-on fluxes in reflow ovens and wave solder systems.  Removes re-condensed fluxes and emissions from condensation traps and heat exchangers. Does not have a flashpoint; can be directly applied to warm surfaces and safely operated in wave solder systems. Is available in a 1L spray bottle, as well as 5, 25 and 200L containers.

Zestron, www.zestron.com

Spectrum II now comes with optional Programmable Tilt + Rotate 5-Axis Fluid Dispenser enables the jet to dispense using five axes of automated control instead of three axes. Additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages. Dispenses underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages. Determines height of die stack’s top layer and dispenses fluid along all four sides of the stack just below the top surface, so that sufficient fluid reaches the top of the stack without overflowing over the top. Fluidmove software provides automatic actuation of tilt and rotation functions during production. Dispenses up to ±30° with 1° resolution in either X or Y axis in tilt mode.

Nordson Asymtek, www.nordsonasymtek.com/tilt

N100 PCB Nibbler is for singulating tab routed printed circuit boards. Tabs are cut by placing them under a blade and stepping on a foot pedal. 100 Psi factory air is needed. Excess material from the tab is stored inside a compartment of the tool and can be removed. Blades come in a variety of tab sizes and routing thicknesses. Standard blade thicknesses are 0.062", 0.093" and 0.120". Custom sizes can be requested. For low- to medium-volume production quantities.

FKN Systek, www.fknsystek.com

Fineplacer Sigma semiautomated die bonder is for large die up to 100mm, combined with a working area of 450 x 300high-density array applications and high bond force (up to 1000N) requirements. Handles a wide variety of wafer-level packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging, including assembly of 2.5D and 3D IC packages. Also can pick up from and bond to 300mm wafers. Vision alignment system provides high resolution at all magnification levels and real-time optimized camera images. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras' full resolution potential is tapped. Features pattern recognition.

Finetech USA, www.finetechusa.com

No. 988 is an electrically-heated, 650°F top-loading batch oven used to process electronic components. Workspace dimensions measure 12' x 1' D x 1' H. 15KW are installed in Incoloy-sheathed tubular heating elements to heat the unit, while a 600 cfm, 1/2-hp recirculating blower provides back-to-front horizontal airflow to the workload. Features 6" insulated walls, aluminized steel exterior, Type 304 stainless steel interior, a manual, counterweighted rear-hinged door, workspace floor reinforced for 100lb. loading, access door at each end of the oven, plus swivel casters with swivel locks and wheel brakes. Controls include a digital programming temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch.               

The Grieve Corp., www.grievecorp.com