Boundary scan is now available in SPEA3030 multi-core in-circuit test. Boundary scan tests are now possible on all cores of the ICT (up to four). Can perform parallel work and simultaneous test sequences. Parallel test of several units under test can be handled.

SPEA, www.spea.com
Goepel electronics, www.goepel.com  

JX-350 is a long board SMT placement machine. Is the successor to LED dedicated mounter JX-300LED. Reportedly improves the placement ability of diffusion lenses for LED production. Has reduced weight of beam and revised head drive control; placement speed increased 18% to 32,000cph. Has the option of a newly developed screw type nozzle; can place six pieces of large components up to 25mm diameter or diffusion lenses simultaneously. Screw type nozzle performs pick, recognition and placement in one pass for the six nozzles. Placement range is a max. 650mm in 1 clamp and 1,200mm in 2 clamps. Can handle up to 1,500mm boards. Can select either electric or mechanical feeder for supply method. Matrix Tray Server TR5S is available as an option.

Juki, www.juki.co.jp/smt_e/index.html

Precision-V no-clean flux remover is nonflammable and non-ozone depleting. Works on no-clean, halide-free, rosin, and aqueous OA fluxes. Has low toxicity.

Techspray, www.techspray.com

PF606-P26 no-clean, halogen-free solder paste is said to prevent BGA non-wet opens and head-on-pillow defects. Is printable, wets and solders well even if BGA components are warped.

Shenmao, www.shenmao.com

EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. or more quickly at elevated temp. Upon curing, has durable bonds with high tensile lap shear, tensile and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi and 12,000-13,000 psi, respectively. Volume resistivity greater than 1014 ohm-cm. Resists water, oils, fuels, acids, bases and salts. Withstands thermal cycling over a temp. range of -60° to +250°F. Shelf life of a year at 75°F in original, unopened containers. Comes in container kits ranging from 0.5 pint to 5 gal.

Master Bond, www.masterbond.com

XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elevated temperatures, do not yellow, and exhibit excellent abrasion resistance. Are thermal transfer printable, semi-gloss white polyimide label materials that use acrylic adhesive systems. Are designed to provide barcode tracking of printed circuit boards and electronic components.  

Polyonics, www.polyonics.com

RW1210 rework system contains selectable operating modes that fully automate removal, placement, and soldering sequences.  Includes enlarged board holder to handle printed circuit boards up to 430mm x 360mm. Comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p high-res display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide superimposed views of component leads and PCB solder pads for alignment using ultra-fine X, Y, and Θ axis µm. Provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and delicate QFPs. Includes five hot air nozzles for components from 2 x 2mm to 55 x 55mm. Has 1200W upper and bottom heaters; 2700W, rapid IR underheater heats bottom surface of the PCB.  

Manncorp, www.manncorp.com  

VERSAMag high-magnification HD inspection system has a multi-axis, high-res camera that tilts and rotates for multiple angle inspection with an adjustable Z-height arm. Has magnification up to 96x and includes real-time video inspection, flexible working heights and intuitive controls. Is ergonomically designed and has measurement and annotation capabilities when paired with FSInspection software. FSInspection software enables operator to provide inspection, documentation and reporting. Operator can capture, annotate, store and share images.

FSInspection, www.fsinspection.com

PICO Toµch controller reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts. Features intuitive touch screen interface for precise control of the valve. Can set precise operating parameters, such as ramp open and close and stroke control. Pulse time can be adjusted in increments as small as 0.01ms. Better slope control delivers more repeatable deposits, while preventing turbulence and air bubbles from entering the fluid.

Nordson EFD, www.nordsonefd.com

PICO Pµlse non-contact jet valve reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz max. bursts. Can jet low- to high-viscosity fluids onto any surface, including uneven and tough-to-reach substrates. Has exchangeable parts; adaptable to a range of applications. Tool-free latch mechanism allows for easy removal of the fluid body.

Nordson EFD, www.nordsonefd.com

Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning. Wetted area can be replaced in seconds, while the valve stays on the production line. Wetted parts are manufactured from black Polyethylene to prevent moisture and UV light from coming into contact with the dispense fluids. Dispenses low to medium viscosity fluids over a range of shot and bead sizes, down to a fraction of a µl. Has internal spring return; valves adaptable for use with Techcon Systems controllers. Seal-less valve design offers moisture-sensitive resistance. Diaphragm creates a barrier between the wetted parts and the air cylinder. Valve comes standard with a mounting bracket kit, valve air hose, luer lock fluid line, sample packet of DMP inserts and a dispensing tip selection pack.

Techcon Systems, www.techconsystems.com

StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for increased throughput and flexibility. Provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out. Handles semiconductor wafers up to 300mm (12") in diameter and supports automated handling and processing of round or square wafers. Processes thin wafers with or without a carrier, depending upon wafer thickness.

Nordson March, nordson.com