Indium11.8HF-SPR solder paste can be reflowed in air and nitrogen.

Fluon PFA EA-2000 resin features built-in functional adhesive group that enables one-step processing with other polymers and metals.

9440IR-U solder robot includes IR preheat system. Integrates a selectable four-zone IR preheat system directly into chassis.

DXU-1001A dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and nitrogen storage.

ALF auto loading feeder eliminates user skill in feeding tape components.

PCAS-1000A stress measurement kit is designed for efficient quality control and quality assurance for PCBs.

HP-520E stencil printer is suitable for any production volume.

SC-CP500-2 pallet cleaner selectable cleaning system comes in five unit sizes, from the single unit device up to a completely automatic cleaning system.

OmniCure AC8-HD (High Dose) series UV LED curing system offers higher optical power and enhanced performance in the same air-cooled mechanical enclosure as its AC8 and AC9 predecessors.

EP42HT-3AO two-component, moderate viscosity epoxy system has good flow properties.

506-03A/B is a two-component 100% solids epoxy encapsulant with a 1:1 volumetric mix ratio.

NS-F851 rosin-based flux for lead-free wave soldering is no-clean and reportedly ensures wetting of all PCB and component substrates for maximum through-hole fill.