NS-F851 rosin-based flux for lead-free wave soldering is no-clean and reportedly ensures wetting of all PCB and component substrates for maximum through-hole fill.

SN100CV P608 D4 solder paste is halogen-free, lead-free and no-clean. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Is said to provide excellent wetting and reduce voiding.

Nihon Superior Co.

nihonsuperior.co.jp/english 

Sigma Line module offers a real-time combination of 3D SPI and 3D AOI measurements.

FH58M FPC connector is 0.25mm pitch.

KY-P3 3D pin inspection now has back-end process AOI capabilities.

Indium8.9HF solder paste is halogen-free, no-clean and has an oxidation barrier said to eliminate head-in-pillow and graping.

Sarcon 20YR‐c is a versatile 0.2mm film that exhibits a thermal conductivity of 4.0W/m•K and a thermal resistance of 0.12°C•in²/W.

Ecolloy lead-free solder paste is a drop-in replacement for SAC 305.

NC 611 solder wire is for lead-free PCB assembly and rework.

No. 895 is a 1000°F (538°C) top-loading oven used for curing composite materials in large molds.

Atom 3 pick-and-place machine combines a pair of Pulsar heads on independent axes with 8-nozzle turret head on a third axis for devices up to 99mm x 99mm.

YSi-SP 3D solder paste inspection machine is based on “1-head solution” concept.