Jedec to Standardize Hybrid Memory Modules
ARLINGTON, VA – Jedec will undertake an effort to standardize hybrid memory modules.
The JC-45 Committee for DRAM Modules intends to form a new subcommittee, chaired by PNY Technologies and Cypress Semiconductor. The kickoff meeting will be held Feb. 28 in Munich, and participation is open (www.jedec.org).
Hybrid memory modules are comprised of different types of memory technologies and leverage some of the beneficial characteristics of each, operating as a system instead of as individual components.
“I am optimistic about the potential benefits of hybrid modules,” said Chris Socci, chairman of the subcommittee. “For example, modules with a DRAM interface that also incorporate the non-volatile characteristics of NAND flash could provide new options for data security in a variety of storage and backup systems in the event of power loss. This new family of modules has the potential to help entire segments of the market ‘go green’ by reducing the need for batteries, and may one day extend to all applications that demand memory.”
Jedec president John Kelly added, “The new hybrid modules activity in JC-45 is part of an ongoing effort within JEDEC to extend memory technologies to meet the industry’s need for innovative solutions that will meet future demands. I am pleased to welcome all interested companies to participate in the development of open industry standards within JEDEC to help enable and grow the market for these types of modules.”
