TOYKO -- The first-day crowds at InterNepcon Japan, held at the Tokyo Big Sight convention center last week, were enough to make getting through the aisles difficult. The following two days, navigation was even more demanding. The electronics industry in Japan is back in gear again.

The 40^th edition of InterNepcon Japan was actually a combination of shows. In addition to PCB fabrication, assembly and test, special sections were set aside for packaging technology, materials, general electronics manufacturing, automotive electronics, LED/OLED manufacturing, and once again, electric vehicles. Separate sections were set aside for weight reduction and for venture firms (start ups).

The show is a playhouse for design and manufacturing engineers. The largest part of the show was related to PCB assembly, but this was perhaps 40% of the overall square footage. For an insight into the thinking in the Japanese manufacturing sector, it is an excellent barometer.

The number of bare board manufacturers was down from last year. Major suppliers such as CMK, NEC and Mektron were very busy outlining their technology roadmaps and new products. LED lighting, because of its commonalities with printed circuit manufacturing, is a new area of growth for several manufacturers. Already prevalent in automotive applications, LED lighting is making significant inroads in broad based commercial applications and is a significant part of the product portfolio of several large printed circuit manufacturers. Mektec featured flexible circuits incorporating optical waveguides.

Embedded components were also featured at both CMK and Dai Nippon Printing, but in conversations with a number of engineers, the issue of “known good part” once the circuit has been laminated has restricted greater adoption until the issues are better understood. In consumer electronics such as timing and handheld devices, there is a significant increase in the use of embedded passive components.

Reduced structural stress in multilayer boards and “Zerowarp” boards were also highlighted. The technology roadmap for lines and spaces indicated that 30 microns on rigid boards in 2011 will become 20 microns by 2015. Flexible lines and spaces are projected to decrease to 5 microns from 7.5 microns by 2015. These are very aggressive targets for bleeding-edge product.

One of the most notable trends on the show floor was the proliferation of x-ray inspection systems. This would tie in with the emphasis of Zerowarp and reduced-stress boards, as well as head-in-pillow (HiP) and other defects associated with Pb-free processing.

In materials, one of the most significant factors has been the skyrocketing cost of tin, silver and other metals. One supplier has reacted by introducing a patented low silver solder paste claimed to outperform SAC 305. Senju featured improved wetting on organic solderability preservatives. Another paste was featured which retained strong bond strength through additional high temperature soldering operations, while another was formulated for improved performance in drop testing. The search for a direct alternative to SnPb37 continues.

On the equipment side, many of the new product offerings shown were developed specifically for the large panel and LED markets. Yamaha introduced a pick-and-place system for panels up to 1.2 meters long as well as a new auto-dispensing screen printer. Large-format inspection systems for the same application were featured by several suppliers.

The second largest part of the show was “Lighting Japan,” which addressed LED and OLED technologies. Held in the East Halls, this show covered the breadth of materials and manufacturing technology for this rapidly growing market. From a few suppliers addressing organic LEDs last year the number tripled as more companies have developed new solutions. From chip suppliers to components to turn key providers, most supplier booths were very busy.

As the demand transitions from automotive and mobile electronics applications into more widespread consumer and industrial markets, there is a high degree of innovation and a wide range of solutions available from the supply base.

Engineers and managers at the show were optimistic, but concerned about both inflation and the value of the yen. Many companies are continuing to expand and build factories outside of Japan, primarily in China, but recent political events have led them to look elsewhere in Asia. One of the themes repeated by many exhibitors is that they are increasingly exporting most of their products to subsidiaries and subcontractors offshore. While the decision making remains at home, there are concerns for the hollowing out of Japan’s manufacturing base.

Industry and government have taken steps to recognize the importance of startups, and a small section of the show was dedicated to new ventures. In a culture where innovation outside of the traditional framework is difficult, it is interesting to note that there is greater recognition and support of new manufacturing ideas and technologies in such a prominent venue.

Estimates of attendance ranged to over 120,000 and when looking at the size of the crowd, it was entirely possible. If considering the atmosphere and quality of contacts and discussions reported by a broad range of exhibitors, 2011 should be a strong year for electronics manufacturing in Japan.

Matthew Holzmann is president of Christopher Associates (christopherweb.com); matt@christopherweb.com.

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