CONKLIN, NY – The first Advanced Research in Electronics Assembly Consortium meeting of the year began with an update on the effects of print paste volume on drop test performance for 0.4 mm pitch CSPs.

The discussion migrated toward thermal characterizations, with a look at the reliability of thermal interface tapes, followed by in-depth studies of unique methods for enhancing the performance of filled polymeric thermal bond lines.

The thermal interface assembly “cookbook” was also reviewed at the event, hosted by Universal Instruments’ Advanced Process Lab.

A look at the overall robustness and reliability of electronics assemblies under conditions of overstress, thermal and isothermal cycling, long-term aging, and more complex loading histories included a focus on BGA and CSP assemblies, but emphasis was placed on configurations found to behave differently.

Presentations looked at pad cratering and an analysis of intermetallic failures on electrolytic NiAu; Pb-free solder microstructure and reliability, including detailed discussions on the thermal cycling of Pb-free BGAs, TSOPs, QFNs and solder joints; thermal cycling and why TSOPs, QFNs, LGAs, and passives are all different from BGAs in this regard; and a look at the reliability of reballed components and Pb-free solder joints on ENEPIG pads.

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