EDINA, MN – SMTA has issued a call for 2009 abstracts for four educational conferences.

The International Conference on Soldering & Reliability takes place May 20-22 in Toronto. The deadline for abstracts is Jan. 16. (Contact melissa@smta.org to request an extension.) Visit http://www.smta.org/education/education.cfm#toronto for more information.

The International Wafer-Level Packaging Conference takes place Oct. 29-30 in Santa Clara, CA. The abstract deadline is Mar. 17. Visit http://www.iwlpc.com/call_for_papers.cfm.

The AIMS Harsh Environment Electronics Symposium takes place in conjunction with SMTAI in San Diego, Oct. 5-6. The deadline for abstracts for both is Mar. 27. Visit http://www.smta.org/education/education.cfm#aims and http://www.smta.org/smtai/call_for_papers.cfm to view the complete call and to submit an abstract.