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TAIPEI -- Foxconn Electronics (Hon Hai) today reported August revenues plunged 24.6% year-over-year to NT$108.2 billion ($3.32 billion).
TAIPEI -- Elitegroup Computer Systems reported August consolidated revenues fell 10.4% year-over-year to NT$6.1 billion ($185.9 million).
ENDICOTT, NY – IBM has awarded Endicott Interconnect Technologies a contract to supply 100% of the PCBs, board level assemblies, and full functional test, including all critical interconnect components for an advanced supercomputing program.
No financial terms were disclosed.
“EI has a long standing relationship with IBM and we’re very pleased to have been chosen as the key supplier for this state-of-the-art solution. EI is committed to supplying high quality, high reliability and cost efficient products and services to IBM,” said Michael J. Hills, senior VP of sales, marketing and product management at EI.
EI is a former manufacturing arm of IBM.
SCOTTSDALE, AZ – The final two quarters of 2009 are forecast to bring a sharp uptick in wafer fab capacity utilization, reaching levels not seen since the third quarter of last year, says IC Insights.
While the IC capacity utilization rate stayed around 90% in 2007 and through the first three quarters of 2008, the economy dropped in the fourth quarter, dragging utilization rates down to 68%, says the firm.
IC Insights noted IC capacity utilization reached a low of 57% in the first quarter, rebounding 21 points to 78% in the following quarter, as OEMs began replenishing inventory. The firm expects industry capacity utilization to increase another 10 points to 88% in the third quarter.
"Though not sinking to the all-time annual low rate of 71.2% in 2001, IC Insights expects the average IC industry capacity rate for the entire global recession year of 2009 to drop to 77.4%," Bill McClean, president of IC Insights, said.
"Strengthening IC capacity utilization rates due to the tremendous capital spending cutbacks in 2008 and 2009 will cause IC ASPs to rebound, with annual increases of 5% forecast between 2010 and 2012," he concluded.
IC Insights’ report follows a SEMI forecast of 64% year-over-year growth in fab spending in 2010. According to SEMI, the overall utilization rate is expected to lag at 70% to 80% by the end of 2009.
EL SEGUNDO, CA -- Global LCD TV shipments rose 14.1% sequentially in the second quarter to 30.7 million units, iSuppli Corp. said.
ELK GROVE VILLAGE, IL -- SigmaTron International today reported revenues fell 32% from a year ago to $26.3 million for its fiscal 2010 first quarter.
IRVINE, CA – The US Patent and Trademark Office has allowed a patent covering Henkel Corp.’s Ablestik Self-Filleting die-attach products and controlled flow technique.
The patent broadly discloses the parameters of the process required to achieve a bondline fillet, using die attach paste materials. It covers a method for attaching a semiconductor die to a substrate or to another die in a stacked arrangement.
The method comprises dispensing an adhesive between the die and the substrate, or between two dies, and subjecting the adhesive to conditions suitable to cure the adhesive. With a controlled flow technique, bondlines as thin as 10 µm have been achieved and can be modified based on application-specific requirements.
DOUARNENEZ, FRANCE -- Asteel, the world's 13th largest EMS company, liquidated its plant here last week and laid off 134 workers, according to published reports.
STOCKHOLM – EMS firm Orbit One AB has acquired an 85% stake in EMS provider Wega Electronics.
No financial terms were disclosed.
The deal, which includes Wega’s factory in Prabuty, Poland, gives Orbit One four manufacturing sites, including two in Sweden and one in Russia.
Wega CEO Grzegorz Kohls holds the remaining 15% stake in the company, which will change its name to Orbit One.
Orbit One had sales of about $23 million last year, according to the CIRCUITS ASSEMBLY Directory of EMS Companies.
