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DURHAM, NC – ACW Technology Inc. plans to open a printed circuit board assembly plant in Durham, NC.

NEW YORK – Dover Corp. today reported fourth-quarter 2009 revenue of $1.5 billion, down 12.7% compared to 2008.

NEWARK, NY – EMS provider IEC Electronics Corp. reported revenue of $18.1 million for the first quarter 2010, up 12.2% year-over-year.
Net income was $753,000, up 29.3% over the first quarter last year.

The company’s Dec. 16 acquisition of General Technology Corp. from Crane Co. had almost no impact on the results, the firm said.

Operating income was 7.2% of sales versus 6% for the same period last year.

In a statement, chairman and CEO W. Barry Gilbert guided for sales to increase from $16.3 million in fiscal second quarter 2009 to approximately $25 million in fiscal second quarter 2010. “While much of the increase will be related to the GTC acquisition, over 20% of the balance is organic growth,” he said.

DANDERYD, SWEDEN -- NOTE AB named Göran Jansson acting CEO and president, replacing Knut Pogost, who assumed the role atop the electronics manufacturing services company just last June.

ST. LOUIS-- LaBarge today fiscal 2010 second-quarter net sales rose 1% from last year to $69 million. Revenues were up 9.3% sequentially, the electronics manufacturing services provider said.

ESPOO, FINLAND – Elcoteq SE will provide Nokia Corp.’s customers with aftermarket services for their Nokia devices.

Elcoteq is expected to start these operations gradually during the second quarter of 2010.

The firms plan to work as a team on other projects in the near future.

No financial terms of their agreement were disclosed.

Elcoteq has a global network of aftermarket service sites that serve consumer electronics and systems solutions customers.

ELKHART, IN – Electronic components manufacturer and assembly services provider CTS Corp. today reported fourth-quarter 2009 revenues of $133.9 million, up 6% sequentially, and down 18% year-over-year.

Net earnings were $4.1 million, compared to a third-quarter net profit of $4.5 million.

EMS segment sales decreased 3% sequentially and 35% year-over-year to $68.4 million, primarily as a result of lower sales in the defense and aerospace market. The segment reported operating profits of $700,000.

Components and sensors segment revenues increased 17% sequentially, driven by a 24% improvement in automotive product shipments with improved market share. Sales in this sector were 49% of total CTS sales in the fourth quarter, compared to 44% in the third quarter.

Sales of electronic components increased 5% over the third quarter of 2009, primarily from higher demand for wireless infrastructure applications.

Sales in automotive sensors and actuators increased 44% compared to the same period last year.

Full-year 2009 revenue was $499 million, down 28% from 2008.

The firm posted a 2009 net loss of $34.1 million, compared to earnings of $28.1 million in 2008.

Management anticipates 2010 sales to increase in the range of 10% to 15% year-over-year.

SINGAPORE – Flextronics today announced third-quarter 2009 net sales of $6.6 billion, up 12% sequentially, and down nearly 28% year-over-year.

TORONTO – Celestica Inc. today reported fourth-quarter revenue of $1.66 billion, down 14.4% year-over-year.

WEST LOTHIAN, UK – A partnership of private firms, public entities and UK universities have formed a foundation aimed at raising the number of industry-ready engineering graduates.

Alarmed at a 45% drop in electronic engineering degrees in the UK, the National Microelectronics Institute has established the UK Electronics Skills Foundation to encourage employers to work with schools to enlighten students on career opportunities in the field. Plans call for enlisting the help of summer schools to encourage students to study for electronics engineering degrees, and providing scholarships that connect all sizes of firms with undergraduate students.

UKESF supporters include the University of Bristol, Edinburgh, Imperial College, Southampton and Surrey. Initial funding has been provided by NMI, BIS (Department for Business Innovation and Skills), SEMTA (the Sector Skills Council for Science, Engineering and Manufacturing Technologies), ARM, Cambridge Silicon Radio, Dialog Semiconductor and Imagination Technologies.

BANNOCKBURN, IL – EMS salary increases reported for 2009 averaged 1.9% for hourly and management employees, and 1.7% for salaried employees, according to IPC’s new 2008-2009 wage and salary report for the North American EMS industry.

In contrast, IPC’s previous EMS salary studies from 2002 through 2007 reported average annual increases in the range of 3% to 3.5%.

The study is based on reports from nearly 130 electronics manufacturing services companies in the US and Canada.

Benefit costs in 2008–2009 climbed to an average of 22.7% of total wages, up from 16.8% in 2007, says IPC. Average work hours remained the same from 2007, at 40 hours per week.

In addition, a declining percentage of companies, approximately 75% percent, are paying 100% of employees’ life insurance premiums.

The study’s findings reflect current economic conditions, IPC said in a press release, noting the recently ended US recession and high unemployment rates.

The report aggregates results from 129 US and Canadian EMS facilities. Mean and median wages, salaries, bonuses and commissions are reported for 31 specific positions.

Companies that participated in the study receive the report free. Other companies may purchase the report at www.ipc.org/ems-wage-salary-report.

AUSTIN – A new research report on 3D through silicon via technology says volume production will prove difficult.

With volume production comes the difficult work of addressing issues of design, thermal management, test, and assembly, TechSearch International says. These issues include installation and qualification of high-volume 300 mm production lines, assembly and test capability, the availability of TSV interposers, and reliability data.

Drivers for the adoption of TSV technology include performance and form factor. However, different needs and economic factors determine the timing of adoption in each application, according to TechSearch, whose founder, Jan Vardaman, is a CIRCUITS ASSEMBLY columnist.

Future 3D TSV applications include DRAM, processors for computing and graphics, FPGAs, as well as processor and memory stacks for wireless products.

The firm highlights in a report the major processes and materials moving into production, including via fabrication methods, via filling, wafer thinning, and bonding methods.

The report provides an update on activities of companies and research organizations. Key barriers to 3D TSV adoption are reviewed with emphasis on design, thermal, and test and assembly issues.