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SAO PAULO – A new trade show for electronics assemblers in Brazil is planned for the fall.

The Global Electronics Manufacturing Expo Brazil will be held at the Expo Center Norte in São Paulo Oct. 5-7.

The new event will feature a conference program, including IPC training and certification workshops from IPC registered training specialists; advanced training workshops from a range of international experts; training workshops from exhibitor and local training companies, and a vendor conference program.

For more information, visit www.gemexpobrazil.com.

EINDHOVEN, THE NETHERLANDS – Assembléon has started a research project to develop a new generation of sustainable pick-and-place solutions for the electronics assembly industry.

The new generation aims to minimize the environmental impact of the machine during the design phase.

Assembléon’s activity is part of an overall development project called SUPREME (SUstainable PRoduction EquipMEnt).

Other partners in this project are firms and institutions from the high-tech Dutch Brainport Region, including the Technical University of Eindhoven, research institute TNO, Xycarb Ceramics, Tegema Group and Fiberworx.

SenterNovem, the sustainability office of the Dutch ministry of economical affairs, and the Dutch Organization for Scientific Research have provided a substantial subsidy for the project.

LAGUNA, PHILIPPINES – Integrated Microelectronics Inc. said it would close a business unit and lay off 405 staff as a result of a client ceasing orders.

TOKYO -- Toyota today rebutted assertions that the problems with gas pedals that led to the recall of millions of its cars are electronic in nature.

COLUMBIA, MD – GDP numbers are the best in more than 18 months, suggesting the recession is in clear retreat, says the National Association of Credit Management.

After a mild recovery in the third quarter, numbers jumped 5.8% in the fourth. The bulk of this growth is attributed to manufacturers starting to replenish inventories, mostly since the beginning of December, says the NACM.

This shift is reflected in the Credit Managers’ Index numbers as well. “The jump in manufacturing was stark and unexpected and, since the decline registered in the last iteration of the index, there has been a major leap in some critical areas,” said Chris Kuehl, Ph.D., economist for the NACM. “The combined CMI saw a jump from 52.9 to 55.1, which is impressive enough, but the real movement came from the manufacturing side,” he said.

The manufacturing sector jumped from 52.1 to 55.1, reversing the trend from the December index when the sector stagnated and slipped in terms of positive factors.

Atmosphere was improved in both manufacturing and service sectors, resulting with the most activity in the combined index’s favorable factors, specifically sales and new credit applications, according to the association.

Sales in the combined index jumped from 56.7 to 60.7, marking the first time this figure has been above 60 in 18 months. There was also progress in new credit applications – a jump from 54.2 to 57 – signaling movement in the credit sector.

One of the biggest leaps came from dollar collections, now at 61.3, after sporting readings in the 40s nine months ago.

The same pattern can be seen in amount of credit extended, now at 58.8, after sitting in the 40s just five months ago.

Thus far, these are the highest numbers seen since February 2009. Since then, growth has been even, but not dramatic, says the NACM. That trend of slow growth is likely to return, but the suggestion from this month’s data is substantial gains for the bulk of the first quarter.

Service sector gains were not as dramatic as the manufacturing sector, but there was growth. In both sectors there has been some improvement in terms of the number of accounts placed for collection and the number of disputes, and there has been a fairly steady decline in the number of bankruptcies as well.

The contrast between January 2009 and January 2010 is stark. It was a year ago the recession reached its deepest point, and the index showed numbers buried in the 40s. Now the index has climbed into solid expansion territory and is well into the mid 50s.

SMYRNA, GA – A number of technical webinars will debut during Virtual PCB, the industry’s virtual trade show and conference for the PCB design, fabrication and assembly markets.

The live event will take place Mar. 2-4.

Scheduled on-demand webinars include Go Greener in Your Cleaner!; How Interconnects Can Screw Up High Speed Serial Link Signals and What Transceivers Can Do About It; Next Generation Design Data Management; Solving Mechanical Challenges with a 3D PCB Environment - Make Sure it Fits the First Time!; Status of the Proliferation of Lead-Free Alloys: 2010; Using FPGAs to Embed Test Instruments into Your PCB Design, and more.

Also available will be downloadable information about these topics: Pb-free alloys; package-on-package; advanced cleaning practices; signal integrity, and counterfeit component identification and mitigation.

Exhibiting firms include Altium, Assembléon, Bare Board Group, Cadence, CIRCUITS ASSEMBLY, Downstream Technologies, EMA Design Automation, EPEC Engineered Technologies, FHP Reps, Imagineering, Kyzen, National Instruments, PRINTED CIRCUIT DESIGN & FAB, Surface Mount Technology Association (SMTA), Sunstone Circuits, UP Media Group, Zuken and more!

Register for free at https://vts.inxpo.com/scripts/Server.nxp?LASCmd=AI:4;F:QS!10100&ShowKey=1783.

Visit http://www.virtual-pcb.com for more information.

Virtual PCB is brought to you by UP Media Group, parent firm of Printed Circuit Design & Fab and Circuits Assembly.

The SMTA is an exclusive sponsor of this event.

BANNOCKBURN, IL – North American-made shipments of printed circuit boards fell 3.2% year-over-year in December, while orders rose 22.1% compared to the same month in 2008.

For the year, shipments were down 21.7%, and orders fell 17.2%. Compared to November, combined shipments increased 12.6%, and orders rose 21.5%, said IPC, which tracks the data.

The book-to-bill ratio dipped but remained positive at 1.04. A ratio of more than 1.0 suggests current demand is ahead of supply, which is a positive indicator for sales growth over the next two to six months.

Rigid PWB shipments fell 3.4%. However, orders were up 27.3% compared to December 2008. For the year, rigid shipments were down 23.2%, and orders dropped 18.1%. Sequentially, rigid PWB shipments increased 13.2%, while orders increased 23.3%. The book-to-bill ratio was 1.05.

Flex circuit shipments for the month fell a slight 0.4%, while orders dropped a dramatic 27.4% year-over-year, according to the association. For 2009, flex shipments were down 1.1%, and orders were down 4.9%. Sequentially, flex shipments rose 4.9%, while orders fell 2.9%. The flex book-to-bill in December slipped to 0.95.

Rigid PWBs represent an estimated 91% of the current industry in North America. In December, 86% of total shipments reported were domestically produced. Domestic production accounted for 86% of rigid and 84% of flex circuit shipments.

REDMOND, WA – Data I/O’s outlook is brightening, the company’s president says in a just-published presentation.

SAN JOSE -- The Semiconductor Industry Association today reported that worldwide semiconductor sales in 2009 were $226.3 billion, a decline of 9% from 2008.

MILWAUKIE, OR – ECD has received a patent on its OK Button.

The feature is standard on MEGAM.O.L.E. 20 and V-M.O.L.E. thermal profilers, and is also an option for OvenCHECKER.

The OK Button provides an automatic ‘Go/No Go’ decision based on preloaded specifications for the desired thermal profile.

ECD manufactures thermal profiling equipment and software.