BANNOCKBURN, IL – Total North American EMS shipments in September were down 9.8% compared to the same month last year, according to IPC's monthly North American EMS Statistical Program. Compared to the preceding month, September shipments decreased 12.4%. The book-to-bill ratio stands at 1.27.

TORONTO – Celestica announced revenue of $2.04 billion in the third quarter, marking a 6% increase from 2022's third quarter.

FONTENAY-AUX-ROSES, FRANCE – Icape Group reported revenue of €136.2 million ($143.9 million) for the first nine months of the year, down 16.3% compared to the same period in 2022.

BILLINGSTAD, NORWAY – Kitron's revenue for the third quarter was €179.2 million ($189.8 million), an increase of 8.3% compared to the €165.5 million ($175.3 million) in revenue for the same quarter last year.

HELSINKI – Incap reported revenue of €50 million ($52.9 million) for the third quarter, a decrease of 29% compared to the €70.6 million ($74.7 million) in revenue for 2022's third quarter.

SPOKANE VALLEY, WA – Keytronic announced revenue of $147.7 million for the first quarter of its fiscal year, in line with its expectations for the quarter.

GLENVIEW, IL – ITW's Test & Measurement and Electronics segment reported $698 million in revenue in the second quarter, a 2.4% decrease from last year's second quarter.

LIVINGSTON, UK – CB Technology announced annual sales of £14.3 million ($17.4 million), marking a 36% increase from last year.

TAIPEI – Foxconn was recently subjected to searches by Chinese tax authorities, according to local reports.

HONG KONG – Wong's Kong King reported first half revenue of HK1.9 billion ($242.8 million), marking a 19% drop compared to the same period last year.

ORLANDO, FL – Worldwide IT spending is projected to total $5.1 trillion in 2024, an increase of 8% from 2023, according to the latest forecast by Gartner. While generative AI has not yet had a material impact on IT spending, investment in AI more broadly is supporting overall IT spending growth.

WASHINGTON – The Semiconductor Research Corporation has unveiled the Microelectronics and Advanced Packaging (MAPT) Roadmap, which defines critical chip research priorities and technology challenges that must be addressed to support the “seismic shifts” outlined in the Decadal Plan for Semiconductors released by SRC and SIA in January 2021.