Shenmao Technology has released SMF-TA52, a zero-residue transient adhesive developed for assemblies using formic acid reflow. The material is designed to hold solder preforms, dies and wafers in position during heating while remaining compatible with the reduction chemistry inside formic acid reflow ovens. SMF-TA52 decomposes during the thermal cycle and reaches zero residue at peak reflow. The adhesive supports dispensing and jetting applications and works with formic acid reflow, vacuum reflow and silver sintering processes. SMF-TA52 is SVHC-free, halogen-free and no-clean.

Shenmao Technology

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