Essemtec Tarantula Dual Lane dispensing platform supports up to three valve heads, and Jet-on-the-Fly achieves up to 1.1 million dph at maximum frequency, and an average of 350,000 dph for complex boards in high-speed paste jetting or 2 million dph for glue jetting applications.

Dispenses or jets solder paste, glue and epoxy, and thermal paste. Typical applications include dam & fill, 3-D dispensing, jetting in cavities, staking, silver epoxy dispensing, shielding, microcoating, dielectric ink, liquid metal, thermal paste, and edge bonding. Supports a board size range from 50 × 50mm up to 560 × 500mm, or identical board size up to 560 × 275mm.

Optional 2-D solder paste inspection with automatic correction for continuous monitoring and optimization. Integrated traceability

Essemtec

https://www.essemtec.com

• Prev
• Next