Essemtec Puma Ultra fully integrated SMT platform combines solder paste jetting, 2-D SPI, glue dispensing, component placement and 2-D AOI.
Tarantula platform performs solder paste jetting with speeds up to 30,000cph and jetting frequencies reaching 1.1 million dots per hour.
Spider, Fox All-in-One and Fox platforms now come with Smart Material Management and Remote Station.
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